Full Process Capabilities

1. 印刷浆料:
   • 无铅焊膏的模板印刷 (SAC305) with ±5% volume accuracy for fine-pitch components (down to 01005).
2. SPI (焊膏检查):
   • 3D optical inspection of paste deposition, ensuring correct volume, position, and shape before component placement.
3. 挑选 & 放置组件:
   • 高精度贴装 (±25μm) SMT元件数量, 包括 01005 被动语态, BGA (0.3毫米间距), and power devices.
4. 回流焊:
   • Lead-free reflow profile (峰值温度: 260℃) with nitrogen option for enhanced wetting on ENIG surfaces.
5. 兴趣区 (自动光学检测):
   • Post-reflow inspection for solder joint defects, 元件未对准, and missing parts.
6. THT (通孔技术):
   • Insertion of through-hole components (relays, 连接器, 变形金刚) for high-current paths.
7. 波峰焊:
   • 无铅波峰焊 (245-255℃) with nitrogen for reliable through-hole joints.
8. 手工焊接:
   • Precision manual soldering for delicate components or rework requirements.
9. 集会:
   • Mechanical assembly of heat sinks, enclosures, and auxiliary components.
10. 成品测试 (功能测试):
    • Customized testing for voltage/current handling, thermal performance, and communication protocols.
11. 质量检查:
    • Final quality audit before shipment, ensuring compliance with IPC-A-610 Class 3 standards.

质量控制点

• SPI: Verifies solder paste thickness, area, and registration to prevent bridging or insufficient solder.
• 兴趣区: Scans 100% of SMT joints for defects like cold solder, tombstoning, or missing components.
• 固定资产投资 (首件检验): Comprehensive evaluation of the first PCBA to confirm design feasibility.
• X射线检测: Checks BGA/CSP joints for voids, 桥接, or misalignment in hidden solder joints.
• 功能测试: Simulates real-world new energy operating conditions (例如, high voltage, temperature cycling).

一站式服务能力

• 印刷电路板制造:
  • Double-sided PCB with 2.4mm thickness, 1-2OZ copper, ENIG finish, and thermal via design for heat dissipation.
• 零部件外包:
  • Sourcing of certified components (capacitors, MOSFETs, IGBT) from authorized distributors, ensuring traceability.
• 表面贴装技术&THT整合:
  • Mixed technology assembly supporting high-power devices (例如, IGBT modules) and fine-pitch ICs.
• 测试 & 认证:
  • 符合 IEC 标准 61727 (solar inverters), UL 1973 (energy storage), and ISO 9001:2015.

New Energy Applications

• Solar Inverters: PCBA for string inverters, central inverters, and micro-inverters with MPPT control.
• Battery Management Systems (BMS): High-voltage BMS for energy storage arrays and EV battery packs.
• 电动汽车充电站: Power electronics for DC fast chargers (60千瓦-150千瓦) and AC charging modules.
• Wind Turbine Controls: Control boards for pitch systems, converter units, and condition monitoring.