Full Process Capabilities

1. Imprimir Pegar:
   • Impresión de plantilla de soldadura en pasta sin plomo (SAC305) with ±5% volume accuracy for fine-pitch components (down to 01005).
2. SPI (Inspección de pasta de soldadura):
   • 3D optical inspection of paste deposition, ensuring correct volume, position, and shape before component placement.
3. Elegir & Place Components:
   • Colocación de alta precisión (±25μm) de componentes SMT, incluido 01005 pasivos, Bgas (0.3paso mm), y dispositivos de potencia.
4. Soldadura de reflujo:
   • Lead-free reflow profile (temperatura máxima: 260°C) with nitrogen option for enhanced wetting on ENIG surfaces.
5. AOI (Inspección óptica automatizada):
   • Post-reflow inspection for solder joint defects, component misalignment, y piezas faltantes.
6. Tht (Tecnología de los agujeros):
   • Insertion of through-hole components (relevos, conectores, transformers) for high-current paths.
7. Soldadura de ondas:
   • Soldadura por ola sin plomo (245-255°C) with nitrogen for reliable through-hole joints.
8. Soldadura con la mano:
   • Precision manual soldering for delicate components or rework requirements.
9. Asamblea:
   • Mechanical assembly of heat sinks, enclosures, and auxiliary components.
10. Prueba FG (Prueba funcional):
    • Customized testing for voltage/current handling, rendimiento térmico, y protocolos de comunicación.
11. Inspección de calidad:
    • Final quality audit before shipment, ensuring compliance with IPC-A-610 Class 3 estándares.

Quality Control Points

• SPI: Verifies solder paste thickness, area, and registration to prevent bridging or insufficient solder.
• AOI: Scans 100% of SMT joints for defects like cold solder, tombstoning, or missing components.
• Fai (Inspección del primer artículo): Comprehensive evaluation of the first PCBA to confirm design feasibility.
• Inspección por rayos X: Checks BGA/CSP joints for voids, puente, or misalignment in hidden solder joints.
• Prueba de función: Simulates real-world new energy operating conditions (P.EJ., high voltage, temperature cycling).

One-Stop Service Capabilities

• PCB Fabrication:
  • Double-sided PCB with 2.4mm thickness, 1-2OZ copper, Acabado ENIG, and thermal via design for heat dissipation.
• Components Outsourcing:
  • Sourcing of certified components (condensadores, MOSFET, IGBTS) from authorized distributors, ensuring traceability.
• Smt&THT Integration:
  • Mixed technology assembly supporting high-power devices (P.EJ., IGBT modules) and fine-pitch ICs.
• Pruebas & Proceso de dar un título:
  • Compliance with IEC 61727 (solar inverters), Ul 1973 (energy storage), and ISO 9001:2015.

New Energy Applications

• Solar Inverters: PCBA for string inverters, central inverters, and micro-inverters with MPPT control.
• Battery Management Systems (BMS): High-voltage BMS for energy storage arrays and EV battery packs.
• EV Charging Stations: Power electronics for DC fast chargers (60kW-150kW) and AC charging modules.
• Wind Turbine Controls: Control boards for pitch systems, converter units, and condition monitoring.