This power supply PCBA solution addresses the rigorous demands of high-power electronics, combining 6-layer signal/power separation with conformal coating for environmental protection. El 1.60mm-thick 6-layer FR4 PCB (Tg≥170°C) ensures thermal stability and low impedance in power delivery, while the multi-layer architecture separates high-voltage domains from low-level control signals to minimize EMI—critical for efficient power conversion. El recubrimiento conforme (typically polyurethane or acrylic) provides a waterproof, dustproof, and corrosion-resistant barrier, ideal for power supplies operating in harsh environments.
- Imprimir Pegar:
- Impresión de plantilla de soldadura en pasta sin plomo (SAC305) with ±5% volume accuracy for power MOSFETs and fine-pitch ICs.
- SPI (Inspección de pasta de soldadura):
- 3D optical verification of paste deposition to prevent solder bridging in high-current paths.
- Elegir & Place Components:
- Colocación de alta precisión (±30μm) de componentes SMT, incluyendo inductores de potencia, DC-DC converters, and 0.5mm pitch controllers.
- Soldadura de reflujo:
- Nitrogen-assisted reflow (pico 260°C) for void-free joints on ENIG surfaces, critical for heat dissipation in power devices.
- AOI (Inspección óptica automatizada):
- Post-reflow inspection for solder defects, component misalignment, and polarity errors.
- Tht (Tecnología de los agujeros):
- Insertion of high-current connectors, transformers, and electrolytic capacitors via automatic inserters.
- Soldadura de ondas:
- Soldadura por ola sin plomo (250-260°C) with nitrogen for reliable through-hole joints in power terminals.
- Soldadura con la mano:
- Precision manual soldering for heat-sensitive components or custom heat sink installations.
- Recubrimiento conforme:
- Uniform application of conformal coating (thickness: 25-50μm) via spray or dip process, with curing at 60-80°C.
- Prueba FG (Prueba funcional):
- Load testing under full/half/no load conditions, voltage regulation, efficiency measurement, and overcurrent protection verification.
- Inspección de calidad:
- Final audit including coating coverage check, Hi-Pot test (1000En DC), and insulation resistance measurement (≥100mΩ).
- SPI: Ensures solder paste consistency in power device pads to prevent thermal runaway.
- Inspección por rayos X: Verifies BGA/CSP joint integrity in controller ICs, asegurando <5% voiding.
- Prueba de función: Simulates overload, short circuit, and input voltage fluctuations (±10%) for reliability.
- Conformal Coating QC: Optical microscopy to check coating uniformity and coverage on all components.
- Hi-Pot Test: Verifies isolation between high-voltage (HV) and low-voltage (LV) domains to prevent arcing.
- PCB Fabrication:
- 6-layer FR4 with 1.60mm thickness, 2OZ copper on power layers, 1OZ on signal layers, and thermal via arrays for heat dissipation.
- Components Outsourcing:
- Sourcing of power-grade components (P.EJ., Infineon MOSFETs, TDK inductors, Teapo high-temperature capacitors).
- Smt&THT Integration:
- Mixed technology assembly supporting power modules (P.EJ., IGBTS, SiC MOSFETs) y circuitos integrados de control.
- Pruebas & Proceso de dar un título:
- Compliance with IEC 62368 (seguridad electrica), EN 61000 (CEM), y UL 60950 para equipos de tecnología de la información.
- Suministros de energía industriales:
24V/48V DC power supplies for factory automation, with active PFC and remote monitoring.
- Servidor & PSU para centros de datos:
Alta eficiencia (≥90%) power supplies for 1U/2U servers, supporting 80 PLUS Platinum certification.
- Inversores de energía renovable:
Inversores DC-AC para sistemas solares/eólicos, featuring MPPT control and grid-tie functionality.
- EV Charging Stations:
High-power DC chargers (60kW-150kW) with galvanic isolation and thermal management.
