Premium 6-Layer FR4 TG170 PCB for High-Reliability Industrial Applications

This 6-layer FR4 TG170 PCB is engineered for high-reliability applications including industrial automation, 5G communication, and medical devices. Featuring a 1.6mm thickness and 1oz copper on all layers, it ensures excellent thermal stability and signal integrity. The ENIG surface finish enhances solderability and long-term durability.

Advanced Layer Architecture for Optimal Signal Integrity

和 4 signal layers and 2 dedicated power/ground planes, this PCB supports controlled impedance routing (50Ω±8%). It minimizes electromagnetic interference (电磁干扰) and enables data transfer rates up to 10Gbps, ideal for USB 3.0, 以太网, and high-frequency signals.

Specialized Features to Boost Reliability

• 沉金表面处理: Provides corrosion resistance and excellent solderability, supporting fine-pitch components down to 0.5mm pitch BGAs.

• Black LPI Solder Mask: Offers UV and chemical resistance, ideal for outdoor and industrial environments.

• Gold Finger Contacts: Ensures durable, low-resistance connections in modular systems with precise plating (2μin gold).

• Precision Outline Routing: Maintains tight mechanical tolerances (±0.1mm) for custom enclosures.

Rigorous Manufacturing & 质量控制

Our fabrication process includes laser direct imaging, high-precision drilling, electroless plating, 和 100% 电气测试. 自动光学检查 (兴趣区) and X-ray checks ensure defect-free PCBs that meet IPC-6012 Class 2 standards.

Wide-Ranging Applications

• Industrial Automation: Supports PLCs, motor drives, and IoT gateways with stable power and fast communication.

• 5G & 无线通讯: Maintains RF integrity for sub-6GHz modules and Wi-Fi 6 devices.

• 医疗器械: Compliant with RoHS and REACH, suitable for portable and diagnostic equipment.

• 航天 & Defense: Withstands extreme temperatures and vibrations for avionics use.