Full Process Capabilities

1. Imprimer Coller:
   • Impression au pochoir de pâte à braser sans plomb (SAC305) with ±5% volume accuracy for fine-pitch components (down to 01005).
2. Spice (Inspection de la pâte à souder):
   • 3D optical inspection of paste deposition, ensuring correct volume, position, and shape before component placement.
3. Prendre & Place Components:
   • Placement de haute précision (±25μm) de composants CMS, y compris 01005 passifs, Bgas (0.3pas en mm), and power devices.
4. Soudeur de reflux:
   • Lead-free reflow profile (température maximale: 260°C) with nitrogen option for enhanced wetting on ENIG surfaces.
5. AOI (Inspection optique automatisée):
   • Post-reflow inspection for solder joint defects, component misalignment, and missing parts.
6. Tht (Technologie à travers):
   • Insertion of through-hole components (relais, connecteurs, transformers) for high-current paths.
7. Soudure d'onde:
   • Soudure à la vague sans plomb (245-255°C) with nitrogen for reliable through-hole joints.
8. Soudure à main:
   • Precision manual soldering for delicate components or rework requirements.
9. Assemblée:
   • Mechanical assembly of heat sinks, enclosures, and auxiliary components.
10. Test FG (Test fonctionnel):
    • Customized testing for voltage/current handling, thermal performance, et les protocoles de communication.
11. Inspection d'assurance qualité:
    • Final quality audit before shipment, ensuring compliance with IPC-A-610 Class 3 normes.

Quality Control Points

• Spice: Verifies solder paste thickness, area, and registration to prevent bridging or insufficient solder.
• AOI: Scans 100% of SMT joints for defects like cold solder, tombstoning, or missing components.
• Fai (Inspection du premier article): Comprehensive evaluation of the first PCBA to confirm design feasibility.
• Inspection aux rayons X: Checks BGA/CSP joints for voids, pontage, or misalignment in hidden solder joints.
• Test de fonction: Simulates real-world new energy operating conditions (Par exemple, high voltage, temperature cycling).

One-Stop Service Capabilities

• PCB Fabrication:
  • Double-sided PCB with 2.4mm thickness, 1-2OZ copper, Finition ENIG, and thermal via design for heat dissipation.
• Components Outsourcing:
  • Sourcing of certified components (condensateurs, MOSFET, IGBTs) from authorized distributors, ensuring traceability.
• Smt&THT Integration:
  • Mixed technology assembly supporting high-power devices (Par exemple, IGBT modules) and fine-pitch ICs.
• Essai & Certification:
  • Compliance with IEC 61727 (solar inverters), Ul 1973 (energy storage), and ISO 9001:2015.

New Energy Applications

• Solar Inverters: PCBA for string inverters, central inverters, and micro-inverters with MPPT control.
• Battery Management Systems (BMS): High-voltage BMS for energy storage arrays and EV battery packs.
• EV Charging Stations: Power electronics for DC fast chargers (60kW-150kW) and AC charging modules.
• Wind Turbine Controls: Control boards for pitch systems, converter units, and condition monitoring.