This 2-layer FR4 PCB addresses the needs of industrial control systems, automation modules, and power management applications requiring a balance of robust design and component integration. Con dimensiones de 140.45×93.72mm y un 2.0MM GRISIÓN, the board provides a stable platform for mounting microcontrollers, communication interfaces, and power components while maintaining mechanical rigidity for industrial environments. Constructed from FR4 material, Ofrece aislamiento eléctrico estable (constante dieléctrica εr = 4.5) y resistencia mecánica, suitable for operation in environments with moderate temperature and vibration.

Arquitectura de capa & Diseño de potencia

  • 2-Apilamiento:
    • Top and bottom signal layers with ground/power planes implemented via copper pours for basic EMI suppression
    • Split power domains (P.EJ., 5V/3.3V) separated by isolation traces to minimize cross-talk
  • 1ONZ (35μm) Espesor de cobre:
    • Admite cargas de corriente moderadas (up to 8A per wide trace) for power-hungry components
    • Copper pour areas on both layers reduce thermal hotspots and improve power distribution

Características de grado industrial

  • Blue LPI Solder Mask:
    • Distinctive color for easy visual inspection and component identification in dense layouts
    • Chemical resistance against industrial contaminants and cleaning agents
  • Acabado superficial de enig:
    • 3–5μm nickel layer for corrosion resistance
    • 0.05–0.1μm gold layer for long-term solderability and wire bonding compatibility
  • Capacidad mixta de SMT+DIP:
    • Smt: High-density placement of 0402 passive components, SOIC/SSOP ICs, and 0.5mm pitch QFP packages
    • ADEREZO: Through-hole mounting for rugged connectors (P.EJ., 0.1” headers, bloques de terminales) and relays

Fabricación & Control de calidad

  • Precision Fabrication:
    • Imágenes directas láser (LDI) for 100μm trace accuracy
    • Chapado de cobre electrolítico con verificación uniforme de espesor
  • Comprehensive Testing:
    • 100% automated optical inspection (AOI) for solder mask coverage and silkscreen clarity
    • Prueba de sonda de vuelo para continuidad eléctrica (≤0.1o) y aislamiento (≥100mΩ)
    • Thermal cycling (-40° C a +85 ° C, 500 cycles) to verify reliability
  • Standards Compliance:
    • Clase IPC-6012 2 para electrónica industrial
    • RoHS/REACH compliant for lead-free and hazardous substance restrictions

Aplicaciones industriales

  • Industrial Sensor Modules:
    Integrates temperature/humidity sensors, analog-to-digital converters, and wireless modules (Zigbee/Bluetooth)
  • Motor Control Units:
    Manages low-voltage DC motors with PWM control, current sensing, and overheat protection
  • Communication Interfaces:
    Enables RS-232/485 to USB conversion or simple protocol bridges for industrial equipment
  • Power Distribution Blocks:
    Distributes 24V DC to multiple loads with circuit protection and status indication