This 2-layer FR4 PCB addresses the needs of industrial control systems, automation modules, and power management applications requiring a balance of robust design and component integration. With dimensions of 140.45×93.72mm and a 2.0mm thickness, the board provides a stable platform for mounting microcontrollers, communication interfaces, and power components while maintaining mechanical rigidity for industrial environments. Constructed from FR4 material, it offers stable electrical insulation (dielectric constant εr=4.5) and mechanical strength, suitable for operation in environments with moderate temperature and vibration.

Layer Architecture & Power Design

  • 2-Layer Stackup:
    • Top and bottom signal layers with ground/power planes implemented via copper pours for basic EMI suppression
    • Split power domains (e.g., 5V/3.3V) separated by isolation traces to minimize cross-talk
  • 1OZ (35μm) Copper Thickness:
    • Supports moderate current loads (up to 8A per wide trace) for power-hungry components
    • Copper pour areas on both layers reduce thermal hotspots and improve power distribution

Industrial-Grade Features

  • Blue LPI Solder Mask:
    • Distinctive color for easy visual inspection and component identification in dense layouts
    • Chemical resistance against industrial contaminants and cleaning agents
  • ENIG Surface Finish:
    • 3–5μm nickel layer for corrosion resistance
    • 0.05–0.1μm gold layer for long-term solderability and wire bonding compatibility
  • Mixed SMT+DIP Capability:
    • SMT: High-density placement of 0402 passive components, SOIC/SSOP ICs, and 0.5mm pitch QFP packages
    • DIP: Through-hole mounting for rugged connectors (e.g., 0.1” headers, terminal blocks) and relays

Manufacturing & Quality Control

  • Precision Fabrication:
    • Laser direct imaging (LDI) for 100μm trace accuracy
    • Electrolytic copper plating with uniform thickness verification
  • Comprehensive Testing:
    • 100% automated optical inspection (AOI) for solder mask coverage and silkscreen clarity
    • Flying probe testing for electrical continuity (≤0.1Ω) and isolation (≥100MΩ)
    • Thermal cycling (-40°C to +85°C, 500 cycles) to verify reliability
  • Standards Compliance:
    • IPC-6012 Class 2 for industrial electronics
    • RoHS/REACH compliant for lead-free and hazardous substance restrictions

Industrial Applications

  • Industrial Sensor Modules:
    Integrates temperature/humidity sensors, analog-to-digital converters, and wireless modules (Zigbee/Bluetooth)
  • Motor Control Units:
    Manages low-voltage DC motors with PWM control, current sensing, and overheat protection
  • Communication Interfaces:
    Enables RS-232/485 to USB conversion or simple protocol bridges for industrial equipment
  • Power Distribution Blocks:
    Distributes 24V DC to multiple loads with circuit protection and status indication