This power supply PCBA solution addresses the rigorous demands of high-power electronics, combining 6-layer signal/power separation with conformal coating for environmental protection. The 1.60mm-thick 6-layer FR4 PCB (Tg≥170°C) ensures thermal stability and low impedance in power delivery, while the multi-layer architecture separates high-voltage domains from low-level control signals to minimize EMI—critical for efficient power conversion. The conformal coating (typically polyurethane or acrylic) provides a waterproof, dustproof, and corrosion-resistant barrier, ideal for power supplies operating in harsh environments.
- Print Paste:
- Stencil printing of lead-free solder paste (SAC305) with ±5% volume accuracy for power MOSFETs and fine-pitch ICs.
- SPI (Solder Paste Inspection):
- 3D optical verification of paste deposition to prevent solder bridging in high-current paths.
- Pick & Place Components:
- High-precision placement (±30μm) of SMT components, including power inductors, DC-DC converters, and 0.5mm pitch controllers.
- Reflow Soldering:
- Nitrogen-assisted reflow (peak 260°C) for void-free joints on ENIG surfaces, critical for heat dissipation in power devices.
- AOI (Automated Optical Inspection):
- Post-reflow inspection for solder defects, component misalignment, and polarity errors.
- THT (Through-Hole Technology):
- Insertion of high-current connectors, transformers, and electrolytic capacitors via automatic inserters.
- Wave Soldering:
- Lead-free wave soldering (250-260°C) with nitrogen for reliable through-hole joints in power terminals.
- Hand Soldering:
- Precision manual soldering for heat-sensitive components or custom heat sink installations.
- Conformal Coating:
- Uniform application of conformal coating (thickness: 25-50μm) via spray or dip process, with curing at 60-80°C.
- FG Test (Functional Test):
- Load testing under full/half/no load conditions, voltage regulation, efficiency measurement, and overcurrent protection verification.
- QA Inspection:
- Final audit including coating coverage check, Hi-Pot test (1000V DC), and insulation resistance measurement (≥100MΩ).
- SPI: Ensures solder paste consistency in power device pads to prevent thermal runaway.
- X-ray Inspection: Verifies BGA/CSP joint integrity in controller ICs, ensuring <5% voiding.
- Function Test: Simulates overload, short circuit, and input voltage fluctuations (±10%) for reliability.
- Conformal Coating QC: Optical microscopy to check coating uniformity and coverage on all components.
- Hi-Pot Test: Verifies isolation between high-voltage (HV) and low-voltage (LV) domains to prevent arcing.
- PCB Fabrication:
- 6-layer FR4 with 1.60mm thickness, 2OZ copper on power layers, 1OZ on signal layers, and thermal via arrays for heat dissipation.
- Components Outsourcing:
- Sourcing of power-grade components (e.g., Infineon MOSFETs, TDK inductors, Teapo high-temperature capacitors).
- SMT&THT Integration:
- Mixed technology assembly supporting power modules (e.g., IGBTs, SiC MOSFETs) and control ICs.
- Testing & Certification:
- Compliance with IEC 62368 (electrical safety), EN 61000 (EMC), and UL 60950 for information technology equipment.
- Industrial Power Supplies:
24V/48V DC power supplies for factory automation, with active PFC and remote monitoring.
- Server & Data Center PSUs:
High-efficiency (≥90%) power supplies for 1U/2U servers, supporting 80 PLUS Platinum certification.
- Renewable Energy Inverters:
DC-AC inverters for solar/wind systems, featuring MPPT control and grid-tie functionality.
- EV Charging Stations:
High-power DC chargers (60kW-150kW) with galvanic isolation and thermal management.
