2-layer FR4 TG170 PCB is engineered for applications requiring robust current handling and reliable performance in a cost-effective design, ideal for power supplies, LED drivers, and industrial control modules. 构造自 FR4 TG170 material (glass transition temperature 170°C), the PCB withstands high-temperature environments, making it suitable for components that generate significant heat. 这 1.2毫米厚度 balances rigidity with weight, 而 2奥兹 (70微米) 铜厚 on both layers supports high currents (每条迹线高达 15A), minimizing voltage drop and resistive heating.
Designed in a 1×4 panel format, the PCB optimizes production efficiency for mass manufacturing, reducing material waste and lowering costs. Each panel contains four identical boards, streamlining assembly processes for high-volume orders. 这 绿色LPI阻焊层 protects circuitry from moisture and chemical damage, 而 白色丝印 provides clear component marking for easy assembly and maintenance. 这 同意 (化学镀镍沉金) surface treatment ensures excellent solderability: the nickel layer (3–5μm) 增加耐用性, and the gold layer (0.05–0.1μm) prevents oxidation, maintaining reliable connections over time.
A key feature is POFV (Plated Over Filled Vias) technology, where vias are filled with conductive material and plated to create a smooth, void-free surface. This eliminates the risk of solder wicking or thermal stress failure, critical for components subjected to repeated reflow cycles. POFV also enables via-in-pad designs, allowing tighter component spacing and more efficient routing in dense layouts.
Manufacturing processes prioritize precision and quality:
- DFM analysis optimizes panelization for minimal breakage during depaneling.
- 电解镀铜 ensures uniform 2OZ thickness, verified by cross-sectional tests.
- Laser drilling creates vias with ±10μm accuracy before POFV filling.
- 100% AOI检查 checks solder mask coverage and silkscreen clarity.
- 热应力测试 confirms reliability at 260°C reflow temperatures.
Engineers will appreciate the PCB’s versatility in both power and signal applications. In consumer electronics, it suits chargers and adapters requiring high-current handling. In industrial settings, it excels in motor controls and power distribution blocks, where TG170 material ensures stability in warm environments. The 1×4 panel format is ideal for OEMs seeking economies of scale without compromising on performance.
By choosing this 2-layer FR4 TG170 PCB, customers gain a solution that merges 2OZ copper durability, POFV reliability, and panelized efficiency. Backed by IPC-6012 Class 2 compliance and RoHS certification, it delivers consistent quality from prototype to mass production—an optimal choice for cost-conscious projects that demand robust power handling and long-term reliability.
