This 2-layer FR4 PCB addresses the needs of industrial control systems, automation modules, and power management applications requiring a balance of robust design and component integration. With dimensions of 140.45×93.72mm and a 2.0độ dày mm, the board provides a stable platform for mounting microcontrollers, communication interfaces, and power components while maintaining mechanical rigidity for industrial environments. Constructed from FR4 material, it offers stable electrical insulation (Hằng số điện môi εr = 4,5) and mechanical strength, suitable for operation in environments with moderate temperature and vibration.
- 2-Layer Stackup:
- Top and bottom signal layers with ground/power planes implemented via copper pours for basic EMI suppression
- Split power domains (e.g., 5V/3.3V) separated by isolation traces to minimize cross-talk
- 1Oz (35μm) Copper Thickness:
- Supports moderate current loads (up to 8A per wide trace) for power-hungry components
- Copper pour areas on both layers reduce thermal hotspots and improve power distribution
- Blue LPI Solder Mask:
- Distinctive color for easy visual inspection and component identification in dense layouts
- Chemical resistance against industrial contaminants and cleaning agents
- ENIG Surface Finish:
- 3–5μm nickel layer for corrosion resistance
- 0.05–0.1μm gold layer for long-term solderability and wire bonding compatibility
- Mixed SMT+DIP Capability:
- SMT: High-density placement of 0402 passive components, SOIC/SSOP ICs, and 0.5mm pitch QFP packages
- DIP: Through-hole mounting for rugged connectors (e.g., 0.1” headers, terminal blocks) and relays
- Precision Fabrication:
- Laser direct imaging (LDI) for 100μm trace accuracy
- Electrolytic copper plating with uniform thickness verification
- Comprehensive Testing:
- 100% automated optical inspection (Aoi) for solder mask coverage and silkscreen clarity
- Flying probe testing for electrical continuity (≤0.1Ω) and isolation (≥100MΩ)
- Thermal cycling (-40°C to +85°C, 500 cycles) to verify reliability
- Standards Compliance:
- IPC-6012 Class 2 for industrial electronics
- RoHS/REACH compliant for lead-free and hazardous substance restrictions
- Industrial Sensor Modules:
Integrates temperature/humidity sensors, analog-to-digital converters, and wireless modules (Zigbee/Bluetooth)
- Motor Control Units:
Manages low-voltage DC motors with PWM control, current sensing, and overheat protection
- Communication Interfaces:
Enables RS-232/485 to USB conversion or simple protocol bridges for industrial equipment
- Power Distribution Blocks:
Distributes 24V DC to multiple loads with circuit protection and status indication
