This 2-layer FR4 PCB addresses the needs of industrial control systems, automation modules, and power management applications requiring a balance of robust design and component integration. Avec des dimensions de 140.45×93.72mm et un 2.0mm d'épaisseur, the board provides a stable platform for mounting microcontrollers, communication interfaces, and power components while maintaining mechanical rigidity for industrial environments. Constructed from FR4 material, Il offre une isolation électrique stable (constante diélectrique εr = 4,5) et résistance mécanique, Convient pour le fonctionnement dans des environnements à température et vibration modérées.

Architecture de calque & Power Design

  • 2-Empilement de calque:
    • Top and bottom signal layers with ground/power planes implemented via copper pours for basic EMI suppression
    • Split power domains (Par exemple, 5V/3.3V) separated by isolation traces to minimize cross-talk
  • 1Oz (35μm) Épaisseur de cuivre:
    • Supports moderate current loads (up to 8A per wide trace) for power-hungry components
    • Copper pour areas on both layers reduce thermal hotspots and improve power distribution

Industrial-Grade Features

  • Masque de soudure LPI bleu:
    • Distinctive color for easy visual inspection and component identification in dense layouts
    • Chemical resistance against industrial contaminants and cleaning agents
  • Finition de surface énig:
    • 3–5 μm de couche de nickel pour la résistance à la corrosion
    • 0.05–0,1 μm de couche d'or pour la soudabilité à long terme et la compatibilité de la liaison filaire
  • Mixed SMT+DIP Capability:
    • Smt: High-density placement of 0402 passive components, SOIC/SSOP ICs, and 0.5mm pitch QFP packages
    • TREMPER: Through-hole mounting for rugged connectors (Par exemple, 0.1»Headers, bornes) and relays

Fabrication & Contrôle de qualité

  • Precision Fabrication:
    • Imagerie directe laser (LDI) for 100μm trace accuracy
    • Electrolytic copper plating with uniform thickness verification
  • Tests complets:
    • 100% automated optical inspection (AOI) for solder mask coverage and silkscreen clarity
    • Test de sonde volante pour la continuité électrique (≤0,1o) et isolement (≥ 100mΩ)
    • Thermal cycling (-40° C à + 85 ° C, 500 cycles) to verify reliability
  • Conformité des normes:
    • Classe IPC-6012 2 for industrial electronics
    • RoHS/REACH compliant for lead-free and hazardous substance restrictions

Applications industrielles

  • Modules de capteurs industriels:
    Integrates temperature/humidity sensors, analog-to-digital converters, and wireless modules (Zigbee/Bluetooth)
  • Motor Control Units:
    Manages low-voltage DC motors with PWM control, current sensing, and overheat protection
  • Interfaces de communication:
    Enables RS-232/485 to USB conversion or simple protocol bridges for industrial equipment
  • Power Distribution Blocks:
    Distributes 24V DC to multiple loads with circuit protection and status indication