The 8-layer BGA Gold Finger FR4 PCB is designed for mission-critical applications requiring high-density component integration and robust electrical connectivity. It suits industrial automation controllers, medical diagnostic equipment, and aerospace avionics.
This PCB features 8 layers—typically 4 signal layers and 4 aviones de potencia/terreno. The stackup enables complex routing for fine-pitch BGAs while maintaining signal integrity. A 2.0mm board thickness ensures mechanical stability under vibration or thermal cycling, guaranteeing long-term reliability.
0.25mm Plugged Vias: Allow via-in-pad construction for BGAs, preventing solder wicking and ensuring reliable connections.
0.1mm Minimum Solder Dam: Improves soldering precision and prevents bridging between pads.
ENIG Surface Treatment: Provides a smooth, Acabado resistente a la corrosión para una excelente soldabilidad..
Gold Plated Fingers (1–3μm): Deliver superior conductivity and wear resistance for edge connector applications.
Laminación secuencial: Aligns internal layers precisely.
Microvia Drilling: Achieves 0.25mm vias with ±5μm accuracy for fine-pitch BGAs.
Selective Gold Plating: Ensures uniform thickness on fingers while ENIG is applied to the rest of the board.
3D AOI & Inspección de rayos X: Verify solder dam integrity and internal via quality.
Industrial: Supports high-speed communication interfaces like CANbus and EtherCAT while withstanding harsh environments.
Médico: Meets strict precision and reliability standards for diagnostic devices.
Aeroespacial: Gold fingers maintain stable connections under vibration and temperature extremes.
Customers gain a solution that balances advanced component integration with durable edge connectivity. The combination of 0.25mm plugged vias, 0.1mm solder dams, Aceptar, and gold-plated fingers makes it ideal for high-density and high-reliability applications. ISO 9001:2015 Certificación y clase IPC-6012 2/3 compliance ensure consistent performance from prototypes to mass production.