This 6-layer FR4 PCB is designed for industrial automation, power control, and communication equipment requiring extensive component integration and reliable performance. Con dimensiones de 289.00×145.00mm y un 1.6MM GRISIÓN, the board provides ample space for high-power devices, relevos, and multiple connectors while maintaining mechanical rigidity via FR4 material (constante dieléctrica εr = 4.5), suitable for long-term operation in environments with temperature fluctuations and vibration.

Arquitectura de capa & Electrical Design

  • 6-Apilamiento:
    • 4 capas de señal + 2 power/ground planes to isolate digital/analog signals and minimize EMI.
    • Inner power planes optimized for 24V industrial power distribution, with ground planes stitched via vias for enhanced shielding.
  • 1ONZ (35μm) Espesor de cobre:
    • Supports up to 8-10A current (wide traces) and reduces power loop impedance via copper pours.
    • Enables fine-pitch routing (min line/space: 75μm/75μm) for high-speed signals (Ethernet, CANopen).

Industrial-Grade Process Features

  • Blue LPI Solder Mask:
    • Enhances visual contrast for component identification in complex layouts.
    • Resists chemicals, oils, and coolants typical in industrial environments.
  • Acabado superficial de enig:
    • 3-5μm nickel layer for oxidation resistance; 0.05-0.1μm gold layer ensures long-term solderability and wire bonding compatibility.
  • SMT+DIP Mixed Assembly:
    • Smt: Supports 0201 passives, QFP/PGA ICs, and 0.5mm pitch BGAs.
    • ADEREZO: Accommodates through-hole connectors (DB25, bloques de terminales) and relays for field wiring.

Fabricación & Control de calidad

  • High-Precision Fabrication:
    • Imágenes directas láser (LDI) for 75μm trace accuracy; electrolytic copper plating ensures uniform thickness.
    • Edge milling for smooth, burr-free surfaces suitable for panel mounting.
  • Comprehensive Testing:
    • 100% AOI for solder mask and silkscreen quality.
    • Prueba de sonda de vuelo para continuidad eléctrica (≤0.1o) y aislamiento (≥100mΩ).
    • Vibration (5-500Hz, 2GRAMO) and thermal cycling (-40° C a +85 ° C, 500 cycles) to simulate industrial conditions.
  • Standards Compliance:
    • Clase IPC-6012 2, RoHS/REACH certified.

Aplicaciones industriales

  • Paneles de control del PLC: Integrates programmable logic controllers, Módulos de E/S, and power management for factory automation.
  • Power Monitoring Systems: Supports current/voltage sensors, RS485 communication, and relay outputs for switchgear monitoring.
  • Industrial Communication Gateways: Enables protocol conversion (Modbus RTU to Ethernet) for smart factory networks.
  • Inversores de energía renovable: Manages solar/wind power conversion with large copper pours for thermal dissipation.