This 2-layer FR4 PCB addresses the needs of industrial automation, sensor networks, and power management applications requiring a balance of compact design and robust performance. Mit Dimensionen von 100×79.69mm und a 1.6mm Dicke, the board offers a versatile platform for integrating microcontrollers, Kommunikationsschnittstellen, and power components in a space-efficient form factor. Hergestellt aus FR4-Material, it ensures stable electrical insulation (Dielektrizitätskonstante εr = 4,5) and mechanical rigidity, suitable for operation in moderate-temperature industrial environments with minimal vibration.
- 2-Ebenenstapel:
- Top and bottom signal layers with ground/power planes implemented via copper pours, reducing electromagnetic interference (EMI) for basic signal integrity.
- Geteilte Machtdomänen (Z.B., 5V/3,3 V) separated by isolation traces to minimize cross-talk between analog and digital sections.
- 1Oz (35μm) Kupferdicke:
- Supports up to 8A current in power traces (≥1mm width) for motor drivers or solenoid valves.
- Enables fine-line routing (Mindestlinie/Raum: 100μm/100μm) for low-speed signals (UART, I2C) and component density.
- Grüne LPI-Lötmaske:
- Standard industrial color for easy visual inspection during assembly and maintenance.
- Chemische Beständigkeit gegen Öle, Kühlmittel, and cleaning agents common in manufacturing environments.
- Rätseloberfläche:
- 3–5μm nickel layer for corrosion protection; 0.05–0.1μm gold layer ensures reliable solderability for both SMT and DIP components, even after long-term storage.
- SMT+DIP Mixed Assembly:
- SMT: Accommodates 0402 Passive Komponenten, SOIC/SSOP-ICs, and 0.5mm pitch QFP packages for high-density integration.
- TAUCHEN: Supports through-hole connectors (Z.B., 0.1″ headers, Klemmenblöcke) and relays for robust field wiring in industrial setups.
- Präzisionsfertigung:
- Laser Direct Imaging (LDI) für eine Spurgenauigkeit von 100 μm, ensuring consistent routing across the board.
- Electrolytic copper plating with uniform thickness verification to maintain conductivity.
- Umfassende Tests:
- 100% automatisierte optische Inspektion (Aoi) to verify solder mask coverage and silkscreen clarity.
- Flying-Probe-Prüfung auf elektrischen Durchgang (≤ 0,1o) und Isolation (≥100 mΩ) to eliminate open/short circuits.
- Wärmespannungstest (260°C reflow cycles) to ensure solder joint reliability during assembly.
- Einhaltung von Standards:
- Erfüllt die IPC-6012-Klasse 2 standards for industrial electronics.
- RoHS/REACH-konform für Bleifreiheit und Beschränkungen für gefährliche Stoffe.
- Industrielle Sensormodule:
Integrates temperature, Luftfeuchtigkeit, or pressure sensors with analog signal conditioning and wireless communication (Z.B., LoRa, BLE).
- Motorsteuergeräte:
Drives low-voltage DC motors in conveyor systems, featuring PWM control, current limiting, und Überhitzungsschutz.
- Kommunikationsschnittstellen:
Enables protocol conversion (Z.B., RS-485 to USB) for legacy industrial equipment integration with modern control systems.
- Power Distribution Panels:
Manages 24V DC power distribution to multiple loads, with circuit protection (fuses, TVS-Dioden) and status indication LEDs.
