软板能力

Layer Count
1 – 8 层数
FPC Material
PI, 宠物, 笔, FR-4
Final Thickness
0.06 – 4.0mm
Board Size
250.00X1200mm
Copper Foil
12um, 18um, 35um, 70um
Min width/Space
3mil/3mil
Holewall Copper Thickness
8 – 20μm
Surface Treatment
HAL leadfree, 同意, Immersion Silver/Tin, OSP
Outlines Dimension
±2mils
Solder Heat Resistance
280℃ / 10secs
Stiffener Type
PI, FR4, Stainless Steel, Aluminum
Min.Hole Dia(PTH)
0.1mm±3mils
Min.Hole Dia(NPTH)
0.25±2mils
Max/Min Soldermask Thickness
2mil/0.5mil (50um/12.7um)
Min Slot
0.8mm×1mm
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