Full Process Capabilities

1. Yazdır Yapıştır:
   • Kurşunsuz lehim pastasının şablon baskısı (SAC305) with ±5% volume accuracy for fine-pitch components (down to 01005).
2. SPI (Lehim macun muayenesi):
   • 3D optical inspection of paste deposition, ensuring correct volume, position, and shape before component placement.
3. Seçmek & Bileşenleri Yerleştir:
   • Yüksek hassasiyetli yerleştirme (±25μm) SMT bileşenlerinin, içermek 01005 pasifler, BGA'lar (0.3mm adım), ve güç cihazları.
4. Yeniden Akış Lehimleme:
   • Lead-free reflow profile (peak temperature: 260°C) with nitrogen option for enhanced wetting on ENIG surfaces.
5. AOI (Otomatik Optik İnceleme):
   • Post-reflow inspection for solder joint defects, component misalignment, and missing parts.
6. Tht (Delikten teknoloji):
   • Insertion of through-hole components (relays, konnektörler, transformers) for high-current paths.
7. Dalga lehimleme:
   • Kurşunsuz dalga lehimleme (245-255°C) with nitrogen for reliable through-hole joints.
8. El Lehimleme:
   • Precision manual soldering for delicate components or rework requirements.
9. Toplantı:
   • Mechanical assembly of heat sinks, enclosures, and auxiliary components.
10. OG Testi (Fonksiyonel Test):
    • Customized testing for voltage/current handling, thermal performance, and communication protocols.
11. KG Denetimi:
    • Final quality audit before shipment, ensuring compliance with IPC-A-610 Class 3 standartlar.

Kalite Kontrol Noktaları

• SPI: Verifies solder paste thickness, alan, and registration to prevent bridging or insufficient solder.
• AOI: taramalar 100% of SMT joints for defects like cold solder, tombstoning, or missing components.
• Fai (İlk Ürün Kontrolü): Comprehensive evaluation of the first PCBA to confirm design feasibility.
• Röntgen Muayenesi: Checks BGA/CSP joints for voids, köprü, or misalignment in hidden solder joints.
• İşlev testi: Simulates real-world new energy operating conditions (Örn., high voltage, temperature cycling).

Tek Noktadan Hizmet Yetenekleri

• PCB İmalatı:
  • Double-sided PCB with 2.4mm thickness, 1-2OZ bakır, ENIG bitişi, and thermal via design for heat dissipation.
• Bileşenlerin Dış Kaynak Kullanımı:
  • Sourcing of certified components (kapasitörler, MOSFETs, IGBTS) yetkili distribütörlerden, ensuring traceability.
• SMT&THT Entegrasyonu:
  • Yüksek güçlü cihazları destekleyen karma teknoloji aksamı (Örn., IGBT modules) and fine-pitch ICs.
• Test & Sertifikasyon:
  • Compliance with IEC 61727 (solar inverters), UL 1973 (energy storage), ve ISO 9001:2015.

New Energy Applications

• Solar Inverters: PCBA for string inverters, central inverters, and micro-inverters with MPPT control.
• Battery Management Systems (BMS): High-voltage BMS for energy storage arrays and EV battery packs.
• EV Charging Stations: Power electronics for DC fast chargers (60kW-150kW) and AC charging modules.
• Wind Turbine Controls: Control boards for pitch systems, converter units, and condition monitoring.