Full Process Capabilities
- Печать вставки:
- Трафаретная печать безвиковой пая (SAC305) with ±5% volume accuracy for fine-pitch components (down to 01005).
- SPI (Осмотр паяльной пасты):
- 3D optical inspection of paste deposition, ensuring correct volume, position, and shape before component placement.
- Выбирать & Поместите компоненты:
- Высокое расположение (±25μm) компонентов SMT, including 01005 пассива, BGAs (0.3мм шаг), and power devices.
- Стрелка пайки:
- Lead-free reflow profile (peak temperature: 260° C.) with nitrogen option for enhanced wetting on ENIG surfaces.
- Аои (Автоматическая оптическая проверка):
- Post-reflow inspection for solder joint defects, component misalignment, and missing parts.
- Это (Технология сквозного):
- Insertion of through-hole components (relays, connectors, transformers) for high-current paths.
- Волна пайки:
- Без свинца волна пайки (245-255° C.) with nitrogen for reliable through-hole joints.
- Ручная пайчка:
- Precision manual soldering for delicate components or rework requirements.
- Сборка:
- Mechanical assembly of heat sinks, enclosures, and auxiliary components.
- FG тест (Функциональный тест):
- Customized testing for voltage/current handling, thermal performance, and communication protocols.
- QA Inspection:
- Final quality audit before shipment, ensuring compliance with IPC-A-610 Class 3 стандарты.
- SPI: Verifies solder paste thickness, область, and registration to prevent bridging or insufficient solder.
- Аои: Сканирование 100% of SMT joints for defects like cold solder, tombstoning, or missing components.
- Фей (Первая статья проверка): Comprehensive evaluation of the first PCBA to confirm design feasibility.
- Рентгеновский осмотр: Checks BGA/CSP joints for voids, bridging, or misalignment in hidden solder joints.
- Функциональный тест: Simulates real-world new energy operating conditions (НАПРИМЕР., high voltage, temperature cycling).
- Изготовление печатной платы:
- Double-sided PCB with 2.4mm thickness, 1-2Оз меди, Загадка финишировать, and thermal via design for heat dissipation.
- Компоненты Аутсорсинг:
- Sourcing of certified components (capacitors, MOSFETs, IGBTS) от уполномоченных дистрибьюторов, ensuring traceability.
- Пост&THT интеграция:
- Сборка смешанной технологии поддерживает мощные устройства (НАПРИМЕР., IGBT modules) and fine-pitch ICs.
- Тестирование & Сертификация:
- Compliance with IEC 61727 (solar inverters), UL 1973 (energy storage), и ISO 9001:2015.
- Solar Inverters: PCBA for string inverters, central inverters, and micro-inverters with MPPT control.
- Battery Management Systems (BMS): High-voltage BMS for energy storage arrays and EV battery packs.
- EV Charging Stations: Power electronics for DC fast chargers (60kW-150kW) and AC charging modules.
- Wind Turbine Controls: Control boards for pitch systems, converter units, and condition monitoring.
