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PCB
10-Layer FR4 Rigid PCB with POFV for High-Speed Industrial
PCB Type
10L Rigid FR4 Board
Board Thickness
2.0mm
Copper Thickness
All layers 1OZ
Solder Mask
Black
Silkscreen
White
Surface Treatment
ENIG
Key Features
BGA support, 0.15mm minimum hole dimension, POFV (Plating Over Filled Vias) process
PCB Fabrication Process
Inner Layer -- Dry Film -- Exposure -- Develop -- Etch -- Strip -- Stack up & Laminate -- Drill -- PTH & Panel Plating -- Dry Film -- Outer pattern transfer -- Solder mask -- Surface Finish --- E-test
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PCB
10-layer Impedance Board
PCB Type
10-layer Impedance Board
Material
FR4
Board Thickness
1.6mm
BGA
Plugged vias
Impedance Control
50Ω±8%
Surface Treatment
ENIG
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PCB
12-layer HDI Board
PCB Type
12-layer HDI Board
Material
FR4 Tg180
Board Thickness
2.0mm
Blind holes
L1-L3, L1-L4, L7-L12, L9-L12
Min. Hole
0.2mm
Surface Treatment
ENIG
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PCB
14-layer Heavy Copper Board
Instruments
PCB Type
14-layer Heavy Copper Board
Material
FR4, High Tg170
Board Thickness
3.5mm
Copper
all layers 3OZ
Min. Hole
0.5mm
Surface Treatment
ENIG
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PCB
2-Layer FR4 Industrial Control PCBA
PCB Type
2L Board
Dimension
98.45mm*79.69mm
Board Thickness
1.60mm
Material
FR4
Copper
1OZ
Solder mask
Green
Silkscreen
White
Surface Treatment
ENIG
Assembly
SMT+DIP
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PCB
2-Layer FR4 Industrial Control PCBA
PCB Type
2L Board
Dimension
100mm*79.69mm
Board Thickness
1.60mm
Material
FR4
Copper
1OZ
Solder mask
Green
Silkscreen
White
Surface Treatment
ENIG
Assembly
SMT+DIP
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PCB
2-Layer FR4 PCB
PCB Type
2L Board
Dimension
15.60mm6.40mm
Panel
1010
Board Thickness
1.0mm
Material
FR4
Copper
1.5OZ
Solder mask
Blue
Silkscreen
White
Surface Treatment
HASL
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PCB
2-layer FR4 PCBA designed for industrial control applications
PCB Type
2L Board
Dimension
140.45mm*93.72mm
Board Thickness
2.0mm
Material
FR4
Copper
1OZ
Solder mask
Blue
Silkscreen
White
Surface Treatment
ENIG
Assembly
SMT+DIP
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PCB
2-Sided PCB PCBA for Printer Connectivity
PCBA Type
Printer Connectivity PCBA with FPC
PCB Structure
2-sided PCB, 1.6mm board thickness
Key Features
FPC integration, IC programming
PCBA Process
Print Paste --- SPI --- Pick up & Place components -- Reflow --- AOI --- THT --- Wave Soldering --- Hand Soldering --- Assembly --- FG Test -- QA Inspection
Quality Check Points
SPI, AOI, FAI, X-ray, Function Test etc.
Service Scope
One-stop service with PCB fabrication, Components outsourcing, SMT, THT and test
PCBA Lead Time
4-5 weeks
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PCB
4 Layer ENIG Board
PCB Type
4 Layer ENIG Board
Material
FR4
Board Thickness
1.6mm
Copper
2OZ
Min. Width & Space
3mils
Au thickness
2.5u’’
Surface Treatment
ENIG
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PCB
4-Layer FR4 Industrial Control PCBA
PCB Type
4L Board
Dimension
350mm*125mm
Board Thickness
1.50mm
Material
FR4
Copper
1OZ
Solder mask
Green
Silkscreen
White
Surface Treatment
ENIG
Assembly
SMT+DIP
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PCB
4-Layer FR4 Industrial Control PCBA
PCB Type
4L Board
Dimension
107.03mm*42.80mm
Board Thickness
1.60mm
Material
FR4
Copper
1OZ
Solder mask
Blue
Silkscreen
White
Surface Treatment
ENIG
Assembly
SMT+DIP
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