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NFKDFDGFSdf (79)

8L POFV Board

PCB Type
8L Board
Board Thickness
1.2mm
Material
FR4
Copper
2OZ
Solder mask
Green
Silkscreen
White
POFV
Plated Over Filled Vias
Surface Treatment
ENIG
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32

Beaglebone-Customized Beverage Dispensing Machine PCBA

Processor
ARM Cortex A8, Sitara 1G HZ, 32-bit RISC
Memory
32G eMMC & 4G DDR3 SDRAM
Customization
Based on Beaglebone Open Source Hardware
Application
Beverage Dispensing Machine
Communication
Wifi, Bluetooth 2-1 TI module
Package
Conformal coating, 0201, QFP, QFN and BGA
Components
Total 143 different types of devices
Testing
OTG/Host USB, DDR3, Bluetooth, Wifi, LED, RTC etc.
Quality Check Points
SPI, AOI, FAI, X-Ray, Function Test
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39

Custom FR4 6-Layer PCB Fabrication Services

PCB Type
6L FR4 Tg170 Board
Board Thickness
1.6mm
Copper Thickness
All layers 1OZ
Solder Mask
Black
Surface Treatment
ENIG
Special Features
Gold Finger, Outline Routing
Panel Requirement
X-out Panel not accepted
PCB Fabrication Process
Inner Layer -- Drill -- PTH & Panel Plating -- Dry Film -- Exposure -- Develop -- Pattern Plating -- Tin Plating -- Dry Film Strip -- Etch -- Tin Strip -- Solder mask -- Surface Finish --- E-test
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38

Double-Sided FR4 TG170 PCB

PCB Type
Double-sided FR4 Tg170 Board
Board Thickness
1.6mm
Copper Thickness
1OZ
Solder Mask
Green
Surface Treatment
HAL Pb-free
Panel Requirement
X-out Panel not accepted
PCB Fabrication Process
Drill -- PTH & Panel Plating -- Dry Film -- Exposure -- Develop -- Pattern Plating -- Tin Plating -- Dry Film Strip -- Etch -- Tin Strip -- Solder mask -- Surface Finish --- E-test
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27

Double-Sided PCBA for Renewable Energy Applications

Full Process Capabilities Print Paste: Stencil printing of lead-free solder paste (SAC305) with ±5% volume accuracy for fine-pitch components (down to 01005). SPI (Solder Paste...
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36

FR4 6-Layer PCB Manufacturer for Industrial Application

PCB Type
6L FR4 Tg170 Board
Board Thickness
1.6mm
Copper Thickness
All layers 1OZ
Solder Mask
Green
Surface Treatment
ENIG
Gold Finger
2 microinches gold thickness
Panel Requirement
X-out Panel not accepted
PCB Fabrication Process
Inner Layer -- Drill -- PTH & Panel Plating -- Dry Film -- Exposure -- Develop -- Pattern Plating -- Tin Plating -- Dry Film Strip -- Etch -- Tin Strip -- Solder mask -- Surface Finish --- E-test
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NFKDFDGFSdf (81)

IATF16949 standard for Automobile Board

PCB Type
Double-sided PCB for Auto
Material
FR4
Board Thickness
1.6mm
Copper
3OZ
Solder mask
LPI Matt Green
Application
IATF16949 standard for Automobile
Surface Treatment
OSP
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NFKDFDGFSdf (78)

POFV Board

PCB Type
2L Board
Panel
1*4
Board Thickness
1.2mm
Material
FR4-TG170
Copper
2OZ
Solder mask
Green
Silkscreen
White
POFV
Plated Over Filled Vias
Surface Treatment
ENIG
Read more
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