Full Process Capabilities

1. 인쇄 붙여넣기:
   • 무연 솔더 페이스트의 스텐실 프린팅 (SAC305) with ±5% volume accuracy for fine-pitch components (down to 01005).
2. SPI (솔더 페이스트 검사):
   • 3D optical inspection of paste deposition, ensuring correct volume, position, and shape before component placement.
3. 선택하다 & 구성요소 배치:
   • 고정밀 배치 (±25μm) SMT 부품 중, 포함 01005 패시브, BGAS (0.3MM 피치), 및 전원 장치.
4. 리플로우 납땜:
   • Lead-free reflow profile (최고 온도: 260℃) with nitrogen option for enhanced wetting on ENIG surfaces.
5. AOI (자동화 된 광학 검사):
   • 솔더 조인트 결함에 대한 리플로우 후 검사, 부품 정렬 불량, 그리고 누락된 부품.
6. tht (통과 기술):
   • Insertion of through-hole components (릴레이, 커넥터, transformers) for high-current paths.
7. 웨이브 납땜:
   • 무연 웨이브 납땜 (245-255℃) with nitrogen for reliable through-hole joints.
8. 손 납땜:
   • Precision manual soldering for delicate components or rework requirements.
9. 집회:
   • Mechanical assembly of heat sinks, enclosures, and auxiliary components.
10. FG 테스트 (기능 테스트):
    • Customized testing for voltage/current handling, thermal performance, 통신 프로토콜.
11. QA 검사:
    • Final quality audit before shipment, ensuring compliance with IPC-A-610 Class 3 표준.

품질 관리 포인트

• SPI: Verifies solder paste thickness, 영역, and registration to prevent bridging or insufficient solder.
• AOI: 스캔 100% of SMT joints for defects like cold solder, tombstoning, or missing components.
• FAI (초도품 검사): Comprehensive evaluation of the first PCBA to confirm design feasibility.
• 엑스레이 검사: Checks BGA/CSP joints for voids, 브리징, or misalignment in hidden solder joints.
• 기능 테스트: Simulates real-world new energy operating conditions (예를 들어, high voltage, temperature cycling).

원스톱 서비스 역량

• PCB 제작:
  • Double-sided PCB with 2.4mm thickness, 1-2오즈 구리, ENIG 마감, and thermal via design for heat dissipation.
• 부품 아웃소싱:
  • Sourcing of certified components (커패시터, MOSFETs, IGBT) 공인 대리점에서, ensuring traceability.
• smt&THT 통합:
  • 고전력 장치를 지원하는 혼합 기술 어셈블리 (예를 들어, IGBT modules) and fine-pitch ICs.
• 테스트 & 인증:
  • Compliance with IEC 61727 (solar inverters), ul 1973 (energy storage), ISO 9001:2015.

New Energy Applications

• Solar Inverters: PCBA for string inverters, central inverters, and micro-inverters with MPPT control.
• Battery Management Systems (BMS): High-voltage BMS for energy storage arrays and EV battery packs.
• EV Charging Stations: Power electronics for DC fast chargers (60kW-150kW) and AC charging modules.
• Wind Turbine Controls: Control boards for pitch systems, converter units, and condition monitoring.