This 2-layer FR4 PCB addresses the needs of industrial control systems, automation modules, and power management applications requiring a balance of robust design and component integration. 치수와 함께 140.45×93.72mm 그리고 a 2.0MM 두께, the board provides a stable platform for mounting microcontrollers, communication interfaces, and power components while maintaining mechanical rigidity for industrial environments. Constructed from FR4 material, 안정적인 전기 절연을 제공합니다 (유전 상수 εR = 4.5) 그리고 기계적 강도, 온도 및 진동이 적당한 환경에서 작동에 적합.
- 2-레이어 스택 업:
- Top and bottom signal layers with ground/power planes implemented via copper pours for basic EMI suppression
- Split power domains (예를 들어, 5V/3.3V) separated by isolation traces to minimize cross-talk
- 1온스 (35μm) 구리 두께:
- Supports moderate current loads (넓은 흔적 당 최대 8A) for power-hungry components
- Copper pour areas on both layers reduce thermal hotspots and improve power distribution
- 블루 LPI 솔더 마스크:
- Distinctive color for easy visual inspection and component identification in dense layouts
- Chemical resistance against industrial contaminants and cleaning agents
- ENIG 표면 마감:
- 3부식성을위한 –5μm 니켈 층
- 0.05장기 용매 성 및 와이어 본딩 호환성을위한 –0.1μm 금 층
- Mixed SMT+DIP Capability:
- smt: High-density placement of 0402 수동 구성 요소, SOIC/SSOP ICs, and 0.5mm pitch QFP packages
- DIP: Through-hole mounting for rugged connectors (예를 들어, 0.1”헤더, 터미널 블록) and relays
- Precision Fabrication:
- 레이저 직접 이미징 (LDI) for 100μm trace accuracy
- Electrolytic copper plating with uniform thickness verification
- 포괄적 인 테스트:
- 100% automated optical inspection (AOI) for solder mask coverage and silkscreen clarity
- Flying probe testing for electrical continuity (≤0.1o) 그리고 격리 (≥100mΩ)
- Thermal cycling (-40° C ~ +85 ° C, 500 사이클) to verify reliability
- Standards Compliance:
- IPC-6012 클래스 2 for industrial electronics
- ROHS/REACH는 무연 및 위험 물질 제한을 준수합니다
- 산업 센서 모듈:
Integrates temperature/humidity sensors, analog-to-digital converters, and wireless modules (Zigbee/Bluetooth)
- Motor Control Units:
Manages low-voltage DC motors with PWM control, current sensing, and overheat protection
- 통신 인터페이스:
Enables RS-232/485 to USB conversion or simple protocol bridges for industrial equipment
- Power Distribution Blocks:
Distributes 24V DC to multiple loads with circuit protection and status indication