This 2-layer FR4 PCB addresses the needs of industrial automation, sensor networks, and power management applications requiring a balance of compact design and robust performance. Avec des dimensions de 100×79.69mm et un 1.6mm d'épaisseur, the board offers a versatile platform for integrating microcontrollers, interfaces de communication, and power components in a space-efficient form factor. Construit à partir de matériau FR4, it ensures stable electrical insulation (constante diélectrique εr = 4,5) et rigidité mécanique, suitable for operation in moderate-temperature industrial environments with minimal vibration.
- 2-Empilement de calque:
- Top and bottom signal layers with ground/power planes implemented via copper pours, reducing electromagnetic interference (EMI) for basic signal integrity.
- Domaines de puissance divisés (Par exemple, 5V/3,3 V) separated by isolation traces to minimize cross-talk between analog and digital sections.
- 1Oz (35μm) Épaisseur de cuivre:
- Supports up to 8A current in power traces (≥1mm width) for motor drivers or solenoid valves.
- Enables fine-line routing (ligne / espace minimum: 100μm/100μm) for low-speed signals (UART, I2C) and component density.
- Masque de soudure LPI vert:
- Standard industrial color for easy visual inspection during assembly and maintenance.
- Résistance chimique aux huiles, liquides de refroidissement, and cleaning agents common in manufacturing environments.
- Finition de surface énig:
- 3–5μm nickel layer for corrosion protection; 0.05–0.1μm gold layer ensures reliable solderability for both SMT and DIP components, even after long-term storage.
- Assemblage mixte SMT + DIP:
- Smt: Accommodates 0402 composants passifs, CI SOIC/SSOP, and 0.5mm pitch QFP packages for high-density integration.
- TREMPER: Supports through-hole connectors (Par exemple, 0.1″ headers, bornes) and relays for robust field wiring in industrial setups.
- Fabrication de précision:
- Imagerie directe laser (LDI) pour une précision de trace de 100 μm, ensuring consistent routing across the board.
- Electrolytic copper plating with uniform thickness verification to maintain conductivity.
- Tests complets:
- 100% inspection optique automatisée (AOI) to verify solder mask coverage and silkscreen clarity.
- Test de sonde volante pour la continuité électrique (≤0,1o) et isolement (≥ 100mΩ) to eliminate open/short circuits.
- Tests de contrainte thermique (260°C reflow cycles) to ensure solder joint reliability during assembly.
- Conformité des normes:
- Conforme à la classe IPC-6012 2 standards for industrial electronics.
- Conforme RoHS/REACH pour les restrictions sur les substances sans plomb et dangereuses.
- Modules de capteurs industriels:
Integrates temperature, humidité, or pressure sensors with analog signal conditioning and wireless communication (Par exemple, LoRa, BLE).
- Unités de commande de moteur:
Drives low-voltage DC motors in conveyor systems, featuring PWM control, current limiting, et protection contre la surchauffe.
- Interfaces de communication:
Permet la conversion du protocole (Par exemple, RS-485 to USB) for legacy industrial equipment integration with modern control systems.
- Power Distribution Panels:
Manages 24V DC power distribution to multiple loads, with circuit protection (fuses, Diodes TVS) and status indication LEDs.
