This 8-layer FR4 PCB addresses the challenges of high-density, narrow-format electronic designs, where space efficiency and signal integrity are critical. Con dimensiones de 165.50×25.90mm y un 1.6MM GRISIÓN, the board provides a compact yet robust platform for integrating complex circuitry in applications such as industrial sensors, communication modules, and portable test equipment. Construido a partir de Material FR4, Ofrece aislamiento eléctrico estable (constante dieléctrica εr = 4.5) y resistencia mecánica, suitable for operation in environments with moderate temperature and vibration.
- 8-Apilamiento:
- 4 capas de señal + 4 Potencia/planos de tierra para una supresión EMI eficiente
- Alternating signal and power planes minimize cross-talk and impedance variations
- 1ONZ (35μm) Espesor de cobre:
- Balances fine-line routing (minimum line/space: 75μm/75μm) with current-carrying capacity (up to 8A per trace)
- Precision Impedance Control:
- 50Ω ±8% for microstrip/stripline configurations
- Critical for maintaining signal integrity in high-speed interfaces (P.EJ., USB 3.0, CAN FD)
- Blue LPI Solder Mask:
- Distinctive color for easy visual inspection in narrow layouts
- Chemical resistance against industrial contaminants
- Acabado superficial de enig:
- 3–5μm nickel layer for corrosion resistance
- 0.05–0.1μm gold layer for long-term solderability and wire bonding compatibility
- Mixed SMT+DIP Assembly:
- SMT support for high-density ICs (P.EJ., microcontrollers, FPGAs)
- DIP compatibility for rugged connectors (P.EJ., 0.1” headers, bloques de terminales) and through-hole components
- High-Precision Fabrication:
- Imágenes directas láser (LDI) for 75μm trace accuracy
- Electrolytic copper plating with ±5% thickness uniformity
- Comprehensive Testing:
- 100% AOI inspection for solder mask and silkscreen quality
- X-ray verification of BGA vias
- Flying probe testing for electrical continuity and isolation
- Environmental Compliance:
- Clase IPC-6012 2 for industrial applications
- ROHS/CUERRA COMPLIZACIÓN PARA RESTRICCIONES DE SUSTANCIAS PELIGROSAS
- Thermal cycling tested (-40° C a +85 ° C, 500 cycles)
- Industrial Sensor Modules:
Supports high-density sensor interfaces, signal conditioning, and communication protocols (P.EJ., Modbus, Profibus) in a narrow form factor.
- Communication Gateways:
Enables multi-protocol conversion (P.EJ., Ethernet to RS-485) with compact PCB real estate.
- Portable Test Equipment:
Integrates measurement circuitry and user interfaces in handheld devices.
- Automotive Control Units:
Fits into space-constrained compartments while maintaining signal integrity in harsh environments.
By integrating 8-layer signal isolation, 1OZ copper conductivity, and ENIG durability, this PCB delivers uncompromised performance in demanding, space-constrained applications. The blue solder mask offers visual distinction in complex layouts, while mixed SMT/DIP assembly supports both high-density digital components and robust field connections. Respaldado por ISO 9001:2015 proceso de dar un título, it provides the foundation for reliable, compact electronic systems requiring both performance and durability.
