This 6-layer FR4 TG170 PCB is a premium electronic substrate designed for high-reliability applications in industrial automation, 5G communication systems, and advanced medical devices. Engineered with a 1.6mm thickness, 1OZ copper on all layers, and an ENIG (Oro de inmersión de níquel electroutolante) acabado superficial, the board combines thermal stability, Integridad de señal, and mechanical precision to meet the demands of complex, high-frequency electronic designs. The TG170 FR4 material (glass transition temperature 170°C) ensures robust performance in elevated-temperature environments, making it ideal for applications where thermal management is critical, such as industrial control panels, wireless base stations, and ruggedized computing systems.
The 6-layer design features 4 signal layers and 2 dedicated power/ground planes, enabling efficient separation of high-speed signals (e.g., USB 3.0, Ethernet) from power circuits to minimize electromagnetic interference (EMI). This architecture supports controlled impedance routing (50Ω ±8%) for high-frequency signals, ensuring signal integrity in applications requiring data transfer rates up to 10Gbps. The 1OZ copper thickness (35μm) balances fine-line routing capabilities (minimum line/space: 75μm/75μm) with moderate current handling (up to 8A per trace), making it suitable for both low-power logic circuits and power-hungry components like voltage regulators or motor drivers.
- ENIG Surface Finish:
The ENIG finish provides a 3-5μm nickel barrier layer to prevent copper oxidation, topped with a 0.05-0.1μm gold layer that ensures excellent solderability and wire bonding compatibility. This finish is ideal for fine-pitch components (down to 0.5mm pitch BGAs) and long-term reliability in harsh environments, as the gold layer resists corrosion and wear.
- Black LPI Solder Mask:
The black solder mask not only enhances visual contrast for component identification in dense layouts but also offers superior UV resistance, making it suitable for outdoor or high-light environments. Additionally, the mask provides chemical resistance against industrial solvents and cleaning agents, protecting the board from degradation during assembly and operation.
- Gold Finger with Precision Plating:
The gold finger contacts, plated with 2 microinches (0.05μm) of gold, deliver exceptional electrical conductivity and corrosion resistance, ensuring reliable pluggable connections in modular systems. This feature is critical for applications requiring frequent board insertion/removal, such as industrial rack-mounted equipment or communication modules, where low contact resistance and mechanical durability are essential.
- Outline Routing:
The board undergoes precision outline routing to achieve tight mechanical tolerances (±0.1mm), ensuring compatibility with custom enclosures or standardized mounting systems. This process creates smooth, burr-free edges, ideal for applications where physical fit and finish are as important as electrical performance.
The PCB is fabricated through a meticulous process to ensure quality and consistency:
- Inner Layer Processing:
Laser direct imaging (LDI) defines 75μm traces on 1OZ copper cores, followed by etching to form the inner circuitry. Automated optical inspection (AOI) verifies trace accuracy and registration before lamination.
- Perforación & Portalo (Plated Through Hole):
High-precision mechanical drilling creates vias with ±50μm accuracy, which are then coated with electroless and electrolytic copper to achieve uniform 35μm thickness, ensuring robust through-hole connections.
- Pattern Plating & Aguafuerte:
Dry film lamination and UV exposure define the outer layer traces, followed by tin plating to protect conductive areas during etching. This subtractive process ensures clean, sharp trace edges for optimal signal performance.
- Acabado superficial & Asamblea:
The ENIG process is applied after solder mask curing, ensuring uniform metal deposition. Gold fingers are treated with extra care to maintain plating thickness and consistency.
- Control de calidad:
Every board undergoes 100% electrical testing (Prueba electrónica) to verify continuity (≤0.1Ω) and isolation (≥100MΩ). X-ray inspection checks via integrity, while AOI ensures solder mask coverage and gold finger quality. X-out panels are strictly rejected to eliminate any defective boards from the supply chain.
- Industrial Automation:
Supports PLCs, motor drives, and industrial IoT gateways with stable power distribution and high-speed communication interfaces (e.g., Profibus, CANopen).
- 5G & Wireless Communication:
Enables RF signal integrity in 5G sub-6GHz modules and Wi-Fi 6 access points, thanks to its controlled impedance layers and low-loss dielectric properties.
- Dispositivos médicos:
Meets biocompatibility requirements for diagnostic equipment and portable medical systems, with RoHS/REACH compliance and lead-free manufacturing.
- Aeroespacial & Defensa:
Withstands vibration, temperature cycling (-40° C a +85 ° C), and harsh environmental conditions in avionics and military electronics.
Compliant with IPC-6012 Class 2 estándares, this 6-layer FR4 TG170 PCB offers a balance of performance, durabilidad, and design flexibility. Its combination of thermal stability, ENIG finish, gold finger contacts, and precise outline routing makes it a strategic choice for engineers developing next-generation systems that require reliable connectivity, mechanical precision, and compliance with global standards. Whether used in smart factory infrastructure, advanced communication networks, or high-reliability medical devices, this PCB delivers the foundation for innovative, high-performance electronics.
