Full Process Capabilities

1. Drucken Einfügen:
   • Schablonendruck von bleifreier Lotpaste (SAC305) with ±5% volume accuracy for fine-pitch components (down to 01005).
2. Spi (Inspektion von Lotpasten):
   • 3D optical inspection of paste deposition, ensuring correct volume, position, and shape before component placement.
3. Wählen & Komponenten platzieren:
   • Hochpräzise Platzierung (±25μm) von SMT-Komponenten, einschließlich 01005 passives, BGAs (0.3MM -Tonhöhe), und Leistungsgeräte.
4. Reflow-Löten:
   • Lead-free reflow profile (Spitzentemperatur: 260° C) with nitrogen option for enhanced wetting on ENIG surfaces.
5. Aoi (Automatisierte optische Inspektion):
   • Post-reflow inspection for solder joint defects, Komponentenfehlausrichtung, und fehlende Teile.
6. Tht (Durchloch-Technologie):
   • Insertion of through-hole components (Relais, Anschlüsse, Transformatoren) for high-current paths.
7. Wellenlöten:
   • Bleifreies Wellenlöten (245-255° C) with nitrogen for reliable through-hole joints.
8. Handlöten:
   • Precision manual soldering for delicate components or rework requirements.
9. Montage:
   • Mechanical assembly of heat sinks, enclosures, and auxiliary components.
10. FG-Test (Funktionstest):
    • Customized testing for voltage/current handling, thermal performance, and communication protocols.
11. QS-Inspektion:
    • Final quality audit before shipment, ensuring compliance with IPC-A-610 Class 3 Standards.

Qualitätskontrollpunkte

• Spi: Verifies solder paste thickness, area, and registration to prevent bridging or insufficient solder.
• Aoi: Scans 100% of SMT joints for defects like cold solder, tombstoning, or missing components.
• Fai (First Article Inspection): Comprehensive evaluation of the first PCBA to confirm design feasibility.
• Röntgeninspektion: Checks BGA/CSP joints for voids, Überbrückung, or misalignment in hidden solder joints.
• Funktionstest: Simulates real-world new energy operating conditions (Z.B., high voltage, temperature cycling).

Serviceleistungen aus einer Hand

• PCB-Herstellung:
  • Double-sided PCB with 2.4mm thickness, 1-2OZ copper, ENIG-Abschluss, and thermal via design for heat dissipation.
• Komponenten-Outsourcing:
  • Sourcing of certified components (Kondensatoren, MOSFETs, IGBTs) from authorized distributors, ensuring traceability.
• SMT&THT-Integration:
  • Mixed technology assembly supporting high-power devices (Z.B., IGBT modules) and fine-pitch ICs.
• Testen & Zertifizierung:
  • Übereinstimmung mit IEC 61727 (solar inverters), Ul 1973 (energy storage), and ISO 9001:2015.

New Energy Applications

• Solar Inverters: PCBA for string inverters, central inverters, and micro-inverters with MPPT control.
• Battery Management Systems (BMS): High-voltage BMS for energy storage arrays and EV battery packs.
• Ladestationen für Elektrofahrzeuge: Power electronics for DC fast chargers (60kW-150 kW) and AC charging modules.
• Wind Turbine Controls: Control boards for pitch systems, converter units, and condition monitoring.