Full Process Capabilities
- Print Paste:
- Stencil printing of lead-free solder paste (SAC305) with ±5% volume accuracy for fine-pitch components (down to 01005).
- Spi (Solder Paste Inspection):
- 3D optical inspection of paste deposition, ensuring correct volume, position, and shape before component placement.
- Pick & Place Components:
- High-precision placement (±25μm) of SMT components, including 01005 passives, BGAs (0.3mm pitch), and power devices.
- Reflow Soldering:
- Lead-free reflow profile (peak temperature: 260°C) with nitrogen option for enhanced wetting on ENIG surfaces.
- Aoi (Automatisierte optische Inspektion):
- Post-reflow inspection for solder joint defects, component misalignment, and missing parts.
- Tht (Durchloch-Technologie):
- Insertion of through-hole components (relays, connectors, transformers) for high-current paths.
- Wave Soldering:
- Lead-free wave soldering (245-255°C) with nitrogen for reliable through-hole joints.
- Hand Soldering:
- Precision manual soldering for delicate components or rework requirements.
- Montage:
- Mechanical assembly of heat sinks, enclosures, and auxiliary components.
- FG Test (Functional Test):
- Customized testing for voltage/current handling, thermal performance, and communication protocols.
- QA Inspection:
- Final quality audit before shipment, ensuring compliance with IPC-A-610 Class 3 Standards.
- Spi: Verifies solder paste thickness, area, and registration to prevent bridging or insufficient solder.
- Aoi: Scans 100% of SMT joints for defects like cold solder, tombstoning, or missing components.
- Fai (First Article Inspection): Comprehensive evaluation of the first PCBA to confirm design feasibility.
- X-ray Inspection: Checks BGA/CSP joints for voids, bridging, or misalignment in hidden solder joints.
- Funktionstest: Simulates real-world new energy operating conditions (e.g., high voltage, temperature cycling).
- PCB Fabrication:
- Double-sided PCB with 2.4mm thickness, 1-2OZ copper, ENIG finish, and thermal via design for heat dissipation.
- Components Outsourcing:
- Sourcing of certified components (capacitors, MOSFETs, IGBTs) from authorized distributors, ensuring traceability.
- SMT&THT Integration:
- Mixed technology assembly supporting high-power devices (e.g., IGBT modules) and fine-pitch ICs.
- Testing & Certification:
- Compliance with IEC 61727 (solar inverters), UL 1973 (energy storage), and ISO 9001:2015.
- Solar Inverters: PCBA for string inverters, central inverters, and micro-inverters with MPPT control.
- Battery Management Systems (BMS): High-voltage BMS for energy storage arrays and EV battery packs.
- EV Charging Stations: Power electronics for DC fast chargers (60kW-150kW) and AC charging modules.
- Wind Turbine Controls: Control boards for pitch systems, converter units, and condition monitoring.
