8-Layer BGA Gold Finger FR4 PCB for High-Density Applications

The 8-layer BGA Gold Finger FR4 PCB is designed for mission-critical applications requiring high-density component integration and robust electrical connectivity. It suits industrial automation controllers, Medizinische diagnostische Ausrüstung, und Luft- und Raumfahrt -Avionik.

PCB Stackup and Structure

This PCB features 8 layers—typically 4 signal layers and 4 Kraft-/Bodenebenen. The stackup enables complex routing for fine-pitch BGAs while maintaining signal integrity. A 2.0mm board thickness ensures mechanical stability under vibration or thermal cycling, guaranteeing long-term reliability.

Schlüsselmerkmale

• 0.25mm Plugged Vias: Allow via-in-pad construction for BGAs, preventing solder wicking and ensuring reliable connections.

• 0.1mm Minimum Solder Dam: Improves soldering precision and prevents bridging between pads.

• REIG -Oberflächenbehandlung: Provides a smooth, Korrosionsbeständige Oberfläche für hervorragende Lötbarkeit.

• Gold Plated Fingers (1–3μm): Deliver superior conductivity and wear resistance for edge connector applications.

Advanced Manufacturing Process

• Sequentielle Laminierung: Aligns internal layers precisely.

• Microvia Drilling: Achieves 0.25mm vias with ±5μm accuracy for fine-pitch BGAs.

• Selective Gold Plating: Ensures uniform thickness on fingers while ENIG is applied to the rest of the board.

• 3D AOI & Röntgeninspektion: Verify solder dam integrity and internal via quality.

Anwendungen

• Industriell: Supports high-speed communication interfaces like CANbus and EtherCAT while withstanding harsh environments.

• Medical: Meets strict precision and reliability standards for diagnostic devices.

• Luft- und Raumfahrt: Gold fingers maintain stable connections under vibration and temperature extremes.

Why Choose This PCB

Customers gain a solution that balances advanced component integration with durable edge connectivity. The combination of 0.25mm plugged vias, 0.1MM Lötdämme, Zustimmen, and gold-plated fingers makes it ideal for high-density and high-reliability applications. ISO 9001:2015 Zertifizierung und IPC-6012-Klasse 2/3 compliance ensure consistent performance from prototypes to mass production.