This industrial control PCBA solution addresses the demanding requirements of manufacturing automation, process control, and industrial IoT systems. Der 6-layer FR4 PCB (Tg≥170°C, 2.0mm Dicke) ensures robust mechanical stability and signal integrity, while the multi-layer architecture separates power and signal domains to minimize EMI—critical for high-reliability industrial environments.
- Drucken Einfügen:
- Schablonendruck von bleifreier Lotpaste (SAC305) with ±5% volume accuracy for 0201 components and 0.5mm pitch BGAs.
- Spi (Inspektion von Lotpasten):
- 3D optical measurement of paste deposition, verifying height, area, and alignment to prevent solder defects.
- Wählen & Komponenten platzieren:
- Hochpräzise Platzierung (±30μm) von SMT-Komponenten, including power MOSFETs, automotive-grade ICs, Und 01005 passives.
- Reflow-Löten:
- Stickstoffunterstütztes Reflow (Spitzentemperatur 260°C) for ENIG surfaces, ensuring void-free solder joints on power components.
- Aoi (Automatisierte optische Inspektion):
- Post-reflow 2D/3D inspection for tombstoning, fehlende Komponenten, and solder bridging.
- Tht (Durchloch-Technologie):
- Einsetzen von Hochstromsteckverbindern (Z.B., M12, Klemmenblöcke) and relays via automatic inserters.
- Wellenlöten:
- Bleifreies Wellenlöten (250-260° C) with nitrogen for reliable through-hole joints in industrial-grade connectors.
- Handlöten:
- Precision manual soldering for heat-sensitive components or custom modifications.
- Montage:
- Mechanical integration of heat sinks, EMI shields, and enclosures with torque-controlled screws.
- FG-Test (Funktionstest):
- Custom testing for voltage/current handling, communication protocols (Modbus, CANopen), and thermal stability.
- QS-Inspektion:
- Final audit per IPC-A-610 Class 2, including visual, dimensional, and electrical checks.
- Spi: Ensures solder paste volume variation <10% to prevent open circuits.
- Aoi: Scans 100% of SMT joints, detecting defects like cold solder and misalignment.
- Fai (First Article Inspection): Comprehensive evaluation of the first PCBA, including X-ray and cross-section analysis.
- Röntgeninspektion: Verifies BGA/CSP joint integrity, sicherzustellen <5% voiding in power components.
- Funktionstest: Simulates industrial operating conditions (Z.B., -40° C bis +85 ° C., 5-500Hz vibration).
- PCB-Herstellung:
- 6-layer FR4 with 2.0mm thickness, 1-2OZ copper, ENIG-Abschluss, and thermal via arrays for power dissipation.
- Komponenten-Outsourcing:
- Sourcing of industrial-grade components (Z.B., Texas Instruments PLC ICs, TE Connectivity relays) from authorized distributors.
- SMT&THT-Integration:
- Mixed technology assembly supporting high-power devices (up to 20A) and fine-pitch digital ICs (0.4MM -Tonhöhe).
- Testen & Zertifizierung:
- Compliance with EN 61000 (EMC), Ul 508 (Industrielle Steuerung), and ISO 9001:2015.
- SPS & SCADA-Systeme:
PCBA for programmable logic controllers, supporting I/O modules and communication interfaces.
- Motor Drive Controls:
Inverters for servo motors, featuring IGBT drivers and current sensing circuits.
- Industrial Communication Hubs:
Multi-protocol gateways (Ethernet/IP to Profibus) with isolated signal paths.
- Condition Monitoring Systems:
PCBA for vibration analysis, temperature sensing, and predictive maintenance modules.
