This 2-layer FR4 PCB addresses the needs of industrial control systems, automation modules, and power management applications requiring a balance of robust design and component integration. Mit Dimensionen von 140.45×93.72mm und a 2.0mm Dicke, the board provides a stable platform for mounting microcontrollers, Kommunikationsschnittstellen, and power components while maintaining mechanical rigidity for industrial environments. Constructed from FR4 material, Es bietet eine stabile elektrische Isolierung (Dielektrizitätskonstante εr = 4,5) und mechanische Stärke, suitable for operation in environments with moderate temperature and vibration.

Layer Architecture & Power Design

  • 2-Layer Stackup:
    • Top and bottom signal layers with ground/power planes implemented via copper pours for basic EMI suppression
    • Split power domains (Z.B., 5V/3.3V) separated by isolation traces to minimize cross-talk
  • 1Oz (35μm) Copper Thickness:
    • Supports moderate current loads (bis zu 8a pro breiter Spur) for power-hungry components
    • Copper pour areas on both layers reduce thermal hotspots and improve power distribution

Industrial-Grade Features

  • Blue LPI Solder Mask:
    • Distinctive color for easy visual inspection and component identification in dense layouts
    • Chemical resistance against industrial contaminants and cleaning agents
  • ENIG Surface Finish:
    • 3–5μm nickel layer for corrosion resistance
    • 0.05–0.1μm gold layer for long-term solderability and wire bonding compatibility
  • Mixed SMT+DIP Capability:
    • SMT: High-density placement of 0402 Passive Komponenten, SOIC/SSOP ICs, and 0.5mm pitch QFP packages
    • TAUCHEN: Through-hole mounting for rugged connectors (Z.B., 0.1” headers, terminal blocks) and relays

Herstellung & Qualitätskontrolle

  • Precision Fabrication:
    • Laser Direct Imaging (LDI) for 100μm trace accuracy
    • Electrolytic copper plating with uniform thickness verification
  • Comprehensive Testing:
    • 100% automated optical inspection (Aoi) for solder mask coverage and silkscreen clarity
    • Flying probe testing for electrical continuity (≤0.1Ω) and isolation (≥100 mΩ)
    • Thermalradfahren (-40° C bis +85 ° C., 500 Zyklen) to verify reliability
  • Standards Compliance:
    • IPC-6012 Class 2 for industrial electronics
    • RoHS/REACH compliant for lead-free and hazardous substance restrictions

Industrial Applications

  • Industrial Sensor Modules:
    Integrates temperature/humidity sensors, analog-to-digital converters, and wireless modules (Zigbee/Bluetooth)
  • Motor Control Units:
    Manages low-voltage DC motors with PWM control, current sensing, and overheat protection
  • Kommunikationsschnittstellen:
    Enables RS-232/485 to USB conversion or simple protocol bridges for industrial equipment
  • Power Distribution Blocks:
    Distributes 24V DC to multiple loads with circuit protection and status indication