This 2-layer FR4 PCB addresses the needs of industrial control systems, automation modules, and power management applications requiring a balance of robust design and component integration. With dimensions of 140.45×93.72mm and a 2.0mm Dicke, the board provides a stable platform for mounting microcontrollers, communication interfaces, and power components while maintaining mechanical rigidity for industrial environments. Constructed from FR4 material, it offers stable electrical insulation (Dielektrizitätskonstante εr = 4,5) and mechanical strength, suitable for operation in environments with moderate temperature and vibration.
- 2-Layer Stackup:
- Top and bottom signal layers with ground/power planes implemented via copper pours for basic EMI suppression
- Split power domains (e.g., 5V/3.3V) separated by isolation traces to minimize cross-talk
- 1Oz (35μm) Copper Thickness:
- Supports moderate current loads (up to 8A per wide trace) for power-hungry components
- Copper pour areas on both layers reduce thermal hotspots and improve power distribution
- Blue LPI Solder Mask:
- Distinctive color for easy visual inspection and component identification in dense layouts
- Chemical resistance against industrial contaminants and cleaning agents
- ENIG Surface Finish:
- 3–5μm nickel layer for corrosion resistance
- 0.05–0.1μm gold layer for long-term solderability and wire bonding compatibility
- Mixed SMT+DIP Capability:
- SMT: High-density placement of 0402 passive components, SOIC/SSOP ICs, and 0.5mm pitch QFP packages
- DIP: Through-hole mounting for rugged connectors (e.g., 0.1” headers, terminal blocks) and relays
- Precision Fabrication:
- Laser direct imaging (LDI) for 100μm trace accuracy
- Electrolytic copper plating with uniform thickness verification
- Comprehensive Testing:
- 100% automated optical inspection (Aoi) for solder mask coverage and silkscreen clarity
- Flying probe testing for electrical continuity (≤0.1Ω) and isolation (≥100MΩ)
- Thermal cycling (-40°C to +85°C, 500 cycles) to verify reliability
- Standards Compliance:
- IPC-6012 Class 2 for industrial electronics
- RoHS/REACH compliant for lead-free and hazardous substance restrictions
- Industrial Sensor Modules:
Integrates temperature/humidity sensors, analog-to-digital converters, and wireless modules (Zigbee/Bluetooth)
- Motor Control Units:
Manages low-voltage DC motors with PWM control, current sensing, and overheat protection
- Communication Interfaces:
Enables RS-232/485 to USB conversion or simple protocol bridges for industrial equipment
- Power Distribution Blocks:
Distributes 24V DC to multiple loads with circuit protection and status indication
