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NFKDFDGFSDF (79)

8L POFV -Vorstand

PCB -Typ
8L Brett
Brettdicke
1.2mm
Material
FR4
Kupfer
2Oz
Lötmaske
Grün
Seidenbildschirm
Weiß
POFV
Plated Over Filled Vias
Oberflächenbehandlung
Zustimmen
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32

Beaglebone-Customized Beverage Dispensing Machine PCBA

Processor
ARM Cortex A8, Sitara 1G HZ, 32-bit RISC
Memory
32G eMMC & 4G DDR3 SDRAM
Customization
Based on Beaglebone Open Source Hardware
Anwendung
Beverage Dispensing Machine
Communication
Wifi, Bluetooth 2-1 TI module
Paket
Conformal coating, 0201, Mf, QFN and BGA
Components
Total 143 different types of devices
Testen
OTG/Host USB, DDR3, Bluetooth, Wifi, LED, RTC etc.
Quality Check Points
Spi, Aoi, Fai, X-Ray, Funktionstest
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39

Custom FR4 6-Layer PCB Fabrication Services

PCB -Typ
6L FR4 Tg170 Board
Brettdicke
1.6mm
Copper Thickness
All layers 1OZ
Lötmaske
Black
Oberflächenbehandlung
Zustimmen
Special Features
Gold Finger, Outline Routing
Panel Requirement
X-out Panel not accepted
PCB Fabrication Process
Inner Layer -- Drill -- PTH & Panel Plating -- Dry Film -- Exposure -- Develop -- Pattern Plating -- Tin Plating -- Dry Film Strip -- Etch -- Tin Strip -- Lötmaske -- Surface Finish --- E-Test
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38

Double-Sided FR4 TG170 PCB

PCB -Typ
Double-sided FR4 Tg170 Board
Brettdicke
1.6mm
Copper Thickness
1Oz
Lötmaske
Grün
Oberflächenbehandlung
HAL Pb-free
Panel Requirement
X-out Panel not accepted
PCB Fabrication Process
Drill -- PTH & Panel Plating -- Dry Film -- Exposure -- Develop -- Pattern Plating -- Tin Plating -- Dry Film Strip -- Etch -- Tin Strip -- Lötmaske -- Surface Finish --- E-Test
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27

Double-Sided PCBA for Renewable Energy Applications

Full Process Capabilities Print Paste: Stencil printing of lead-free solder paste (SAC305) with ±5% volume accuracy for fine-pitch components (down to 01005). Spi (Solder Paste...
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36

FR4 6-Layer PCB Manufacturer for Industrial Application

PCB -Typ
6L FR4 Tg170 Board
Brettdicke
1.6mm
Copper Thickness
All layers 1OZ
Lötmaske
Grün
Oberflächenbehandlung
Zustimmen
Gold Finger
2 microinches gold thickness
Panel Requirement
X-out Panel not accepted
PCB Fabrication Process
Inner Layer -- Drill -- PTH & Panel Plating -- Dry Film -- Exposure -- Develop -- Pattern Plating -- Tin Plating -- Dry Film Strip -- Etch -- Tin Strip -- Lötmaske -- Surface Finish --- E-Test
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NFKDFDGFSDF (81)

IATF16949 Standard für Automobilboard

PCB -Typ
Double-sided PCB for Auto
Material
FR4
Brettdicke
1.6mm
Kupfer
3Oz
Lötmaske
LPI Matt Green
Anwendung
IATF16949 standard for Automobile
Oberflächenbehandlung
OSP
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NFKDFDGFSDF (78)

POFV -Vorstand

PCB -Typ
2L Brett
Panel
1*4
Brettdicke
1.2mm
Material
FR4-TG170
Kupfer
2Oz
Lötmaske
Grün
Seidenbildschirm
Weiß
POFV
Plated Over Filled Vias
Oberflächenbehandlung
Zustimmen
Mehr lesen
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