This 2-layer FR4 PCB addresses the needs of industrial automation, sensor networks, and power management applications requiring a balance of compact design and robust performance. Với kích thước của 100×79.69mm và một 1.6độ dày mm, the board offers a versatile platform for integrating microcontrollers, communication interfaces, and power components in a space-efficient form factor. Constructed from FR4 material, it ensures stable electrical insulation (Hằng số điện môi εr = 4,5) and mechanical rigidity, suitable for operation in moderate-temperature industrial environments with minimal vibration.
- 2-Xếp chồng lớp:
- Top and bottom signal layers with ground/power planes implemented via copper pours, reducing electromagnetic interference (Emi) for basic signal integrity.
- Split power domains (ví dụ., 5V/3.3V) separated by isolation traces to minimize cross-talk between analog and digital sections.
- 1Oz (35μm) Độ dày đồng:
- Supports up to 8A current in power traces (≥1mm width) for motor drivers or solenoid valves.
- Enables fine-line routing (dòng/khoảng trắng tối thiểu: 100μm/100μm) for low-speed signals (UART, I2C) and component density.
- Green LPI Solder Mask:
- Standard industrial color for easy visual inspection during assembly and maintenance.
- Chemical resistance against oils, coolants, and cleaning agents common in manufacturing environments.
- Bề mặt hoàn thiện ENIG:
- 3–5μm nickel layer for corrosion protection; 0.05–0.1μm gold layer ensures reliable solderability for both SMT and DIP components, even after long-term storage.
- Hội hỗn hợp SMT + DIP:
- SMT: Accommodates 0402 thành phần thụ động, SOIC/SSOP ICs, and 0.5mm pitch QFP packages for high-density integration.
- NHÚNG: Supports through-hole connectors (ví dụ., 0.1″ headers, khối thiết bị đầu cuối) and relays for robust field wiring in industrial setups.
- Precision Fabrication:
- Laser direct imaging (LDI) for 100μm trace accuracy, ensuring consistent routing across the board.
- Electrolytic copper plating with uniform thickness verification to maintain conductivity.
- Kiểm tra toàn diện:
- 100% automated optical inspection (Aoi) to verify solder mask coverage and silkscreen clarity.
- Kiểm tra đầu dò bay để đảm bảo tính liên tục của điện (.10,1Ω) và sự cô lập (≥100MΩ) to eliminate open/short circuits.
- Kiểm tra ứng suất nhiệt (260°C reflow cycles) to ensure solder joint reliability during assembly.
- Tuân thủ tiêu chuẩn:
- Meets IPC-6012 Class 2 standards for industrial electronics.
- RoHS/REACH compliant for lead-free and hazardous substance restrictions.
- Industrial Sensor Modules:
Integrates temperature, độ ẩm, or pressure sensors with analog signal conditioning and wireless communication (ví dụ., LoRa, BLE).
- Motor Control Units:
Drives low-voltage DC motors in conveyor systems, featuring PWM control, current limiting, and overheat protection.
- Giao diện giao tiếp:
Cho phép chuyển đổi giao thức (ví dụ., RS-485 to USB) for legacy industrial equipment integration with modern control systems.
- Power Distribution Panels:
Manages 24V DC power distribution to multiple loads, with circuit protection (fuses, TVS diodes) and status indication LEDs.
