This industrial control PCBA solution addresses the demanding requirements of manufacturing automation, process control, and industrial IoT systems. . 6-layer FR4 PCB (Tg≥170°C, 2.0mm kalınlığı) ensures robust mechanical stability and signal integrity, while the multi-layer architecture separates power and signal domains to minimize EMI—critical for high-reliability industrial environments.
- Print Paste:
- Stencil printing of lead-free solder paste (SAC305) with ±5% volume accuracy for 0201 components and 0.5mm pitch BGAs.
- SPI (Solder Paste Inspection):
- 3D optical measurement of paste deposition, verifying height, area, and alignment to prevent solder defects.
- Pick & Place Components:
- High-precision placement (±30μm) of SMT components, including power MOSFETs, automotive-grade ICs, Ve 01005 passives.
- Reflow Soldering:
- Nitrogen-assisted reflow (peak 260°C) for ENIG surfaces, ensuring void-free solder joints on power components.
- AOI (Otomatik Optik İnceleme):
- Post-reflow 2D/3D inspection for tombstoning, Eksik bileşenler, and solder bridging.
- Tht (Delikten teknoloji):
- Insertion of high-current connectors (Örn., M12, terminal blocks) and relays via automatic inserters.
- Wave Soldering:
- Lead-free wave soldering (250-260°C) with nitrogen for reliable through-hole joints in industrial-grade connectors.
- Hand Soldering:
- Precision manual soldering for heat-sensitive components or custom modifications.
- Toplantı:
- Mechanical integration of heat sinks, EMI shields, and enclosures with torque-controlled screws.
- FG Test (Functional Test):
- Custom testing for voltage/current handling, communication protocols (Modbus, CANopen), and thermal stability.
- QA Inspection:
- Final audit per IPC-A-610 Class 2, including visual, dimensional, and electrical checks.
- SPI: Ensures solder paste volume variation <10% to prevent open circuits.
- AOI: Scans 100% of SMT joints, detecting defects like cold solder and misalignment.
- Fai (First Article Inspection): Comprehensive evaluation of the first PCBA, including X-ray and cross-section analysis.
- X-ray Inspection: Verifies BGA/CSP joint integrity, ensuring <5% voiding in power components.
- İşlev testi: Simulates industrial operating conditions (Örn., -40°C to +85°C, 5-500Hz vibration).
- PCB Fabrication:
- 6-layer FR4 with 2.0mm thickness, 1-2OZ copper, ENIG finish, and thermal via arrays for power dissipation.
- Components Outsourcing:
- Sourcing of industrial-grade components (Örn., Texas Instruments PLC ICs, TE Connectivity relays) from authorized distributors.
- SMT&THT Integration:
- Mixed technology assembly supporting high-power devices (up to 20A) and fine-pitch digital ICs (0.4mm pitch).
- Test & Certification:
- Compliance with EN 61000 (EMC), UL 508 (industrial control), and ISO 9001:2015.
- PLC & SCADA Systems:
PCBA for programmable logic controllers, supporting I/O modules and communication interfaces.
- Motor Drive Controls:
Inverters for servo motors, featuring IGBT drivers and current sensing circuits.
- Industrial Communication Hubs:
Multi-protocol gateways (Ethernet/IP to Profibus) with isolated signal paths.
- Condition Monitoring Systems:
PCBA for vibration analysis, temperature sensing, and predictive maintenance modules.
