This industrial control PCBA solution addresses the demanding requirements of manufacturing automation, process control, and industrial IoT systems. Le 6-carte PCB de la couche FR4 (Tg≥170°C, 2.0mm d'épaisseur) ensures robust mechanical stability and signal integrity, while the multi-layer architecture separates power and signal domains to minimize EMI—critical for high-reliability industrial environments.
- Imprimer Coller:
- Impression au pochoir de pâte à braser sans plomb (SAC305) avec une précision de volume de ± 5 % pour 0201 components and 0.5mm pitch BGAs.
- Spice (Inspection de la pâte à souder):
- 3D optical measurement of paste deposition, verifying height, zone, and alignment to prevent solder defects.
- Prendre & Placer des composants:
- Placement de haute précision (±30μm) de composants CMS, including power MOSFETs, automotive-grade ICs, et 01005 passifs.
- Soudeur de reflux:
- Refusion assistée par l'azote (pointe 260°C) for ENIG surfaces, ensuring void-free solder joints on power components.
- AOI (Inspection optique automatisée):
- Post-reflow 2D/3D inspection for tombstoning, Composants manquants, and solder bridging.
- Tht (Technologie à travers):
- Insertion of high-current connectors (Par exemple, M12, bornes) and relays via automatic inserters.
- Soudure d'onde:
- Soudure à la vague sans plomb (250-260°C) with nitrogen for reliable through-hole joints in industrial-grade connectors.
- Soudure à main:
- Precision manual soldering for heat-sensitive components or custom modifications.
- Assemblée:
- Mechanical integration of heat sinks, EMI shields, and enclosures with torque-controlled screws.
- Test FG (Test fonctionnel):
- Custom testing for voltage/current handling, communication protocols (Modbus, Canopen), and thermal stability.
- Inspection d'assurance qualité:
- Audit final selon la classe IPC-A-610 2, including visual, dimensional, and electrical checks.
- Spice: Assure la variation du volume de pâte à souder <10% to prevent open circuits.
- AOI: Analyses 100% of SMT joints, detecting defects like cold solder and misalignment.
- Fai (Inspection du premier article): Comprehensive evaluation of the first PCBA, including X-ray and cross-section analysis.
- Inspection aux rayons X: Verifies BGA/CSP joint integrity, assurer <5% voiding in power components.
- Test de fonction: Simulates industrial operating conditions (Par exemple, -40° C à + 85 ° C, 5-500Hz vibration).
- Fabrication de PCB:
- 6-layer FR4 with 2.0mm thickness, 1-2Cuivre OZ, Finition ENIG, and thermal via arrays for power dissipation.
- Externalisation des composants:
- Sourcing of industrial-grade components (Par exemple, Texas Instruments PLC ICs, TE Connectivity relays) auprès de distributeurs agréés.
- Smt&Intégration THT:
- Assemblage à technologies mixtes prenant en charge les appareils haute puissance (up to 20A) and fine-pitch digital ICs (0.4pas en mm).
- Essai & Attestation:
- Compliance with EN 61000 (CEM), Ul 508 (industrial control), et ISO 9001:2015.
- API & Systèmes SCADA:
PCBA for programmable logic controllers, supporting I/O modules and communication interfaces.
- Motor Drive Controls:
Inverters for servo motors, featuring IGBT drivers and current sensing circuits.
- Industrial Communication Hubs:
Multi-protocol gateways (Ethernet/IP to Profibus) with isolated signal paths.
- Condition Monitoring Systems:
PCBA for vibration analysis, temperature sensing, and predictive maintenance modules.
