2-layer FR4 TG170 PCB is engineered for applications requiring robust current handling and reliable performance in a cost-effective design, ideal for power supplies, LED drivers, and industrial control modules. Construido a partir de FR4 TG170 material (glass transition temperature 170°C), the PCB withstands high-temperature environments, making it suitable for components that generate significant heat. El 1.2MM GRISIÓN balances rigidity with weight, mientras el 2ONZ (70μm) espesor de cobre on both layers supports high currents (hasta 15a por rastro), minimizing voltage drop and resistive heating.
Designed in a 1×4 panel format, the PCB optimizes production efficiency for mass manufacturing, reducing material waste and lowering costs. Each panel contains four identical boards, streamlining assembly processes for high-volume orders. El Green LPI solder mask protects circuitry from moisture and chemical damage, mientras el White silkscreen provides clear component marking for easy assembly and maintenance. El Aceptar (Oro de inmersión de níquel electroutolante) surface treatment ensures excellent solderability: the nickel layer (3–5μm) agrega durabilidad, and the gold layer (0.05–0.1μm) prevents oxidation, maintaining reliable connections over time.
A key feature is POFV (Plated Over Filled Vias) technology, where vias are filled with conductive material and plated to create a smooth, void-free surface. This eliminates the risk of solder wicking or thermal stress failure, critical for components subjected to repeated reflow cycles. POFV also enables via-in-pad designs, allowing tighter component spacing and more efficient routing in dense layouts.
Manufacturing processes prioritize precision and quality:
- DFM analysis optimizes panelization for minimal breakage during depaneling.
- Enchapado de cobre electrolítico ensures uniform 2OZ thickness, verified by cross-sectional tests.
- Laser drilling creates vias with ±10μm accuracy before POFV filling.
- 100% Inspección AOI checks solder mask coverage and silkscreen clarity.
- Prueba de estrés térmico confirms reliability at 260°C reflow temperatures.
Engineers will appreciate the PCB’s versatility in both power and signal applications. In consumer electronics, it suits chargers and adapters requiring high-current handling. In industrial settings, it excels in motor controls and power distribution blocks, where TG170 material ensures stability in warm environments. The 1×4 panel format is ideal for OEMs seeking economies of scale without compromising on performance.
By choosing this 2-layer FR4 TG170 PCB, customers gain a solution that merges 2OZ copper durability, POFV reliability, and panelized efficiency. Backed by IPC-6012 Class 2 compliance and RoHS certification, it delivers consistent quality from prototype to mass production—an optimal choice for cost-conscious projects that demand robust power handling and long-term reliability.
