10-layer impedance controlled FR4 PCB is engineered for high-speed electronic systems requiring precise signal integrity, such as data centers, network equipment, and advanced communication devices. The multi-layer structure combines 10 layers of FR4 substrate (1.6mm total thickness) to enable complex routing for high-density circuits, Trong khi BGA (Ball Grid Array) with plugged vias ensures reliable interconnects for critical components. Các 50Ω±8% impedance control minimizes signal reflection and crosstalk, making it ideal for high-frequency applications like PCIe 4.0, USB 3.2, or Ethernet systems.
Các Đồng ý (Điện phân Niken Vàng) surface treatment provides a smooth, oxidation-resistant finish, enhancing solderability and long-term reliability. FR4 material offers a balance of cost-effectiveness and electrical stability (Hằng số điện môi εr = 4,5), suitable for both commercial and industrial use. Our advanced manufacturing process includes:
- Hình ảnh trực tiếp bằng laser (LDI) for fine-line precision (Chiều rộng/không gian dòng tối thiểu: 50μm/50μm)
- Automated Impedance Testing at each layer to ensure ±8% tolerance compliance
- 100% Aoi (Kiểm tra quang học tự động) and flying probe tests for defect detection
As an ISO 9001:2015 certified manufacturer, Chúng tôi cung cấp DFM (Design for Manufacturability) analysis to optimize your design for production, reducing costs and lead times. This PCB is ideal for engineers seeking high-performance, reliable solutions for next-gen electronics.
