This double-sided PCB is engineered specifically for automotive applications, where reliability, thermal performance, and compliance with industry standards are critical. İnşa edildi FR4 material with a 1.6mm kalınlığı, it provides a robust foundation for automotive electronics, balancing mechanical stability with thermal dissipation. . 3Oz (105μm) copper weight on both sides significantly enhances current-carrying capacity (up to 20A per trace), making it ideal for high-power automotive circuits such as motor controls, LED lighting drivers, and power distribution modules.

 

. LPI (Liquid Photoimageable) Matt Green solder mask offers several advantages tailored to automotive needs. Its matte finish reduces glare during automated optical inspection (AOI), improving defect detection accuracy. The liquid-based application ensures uniform coverage, even on complex trace patterns, while providing excellent protection against environmental factors such as moisture, kimyasallar, and abrasion—common challenges in automotive environments. . Osp (Organic Solderability Preservative) finish provides a thin, protective coating that preserves solderability during assembly while meeting automotive requirements for lead-free and RoHS-compliant materials. OSP is particularly well-suited for automotive applications due to its compatibility with multiple soldering processes (wave, reflow, and selective soldering) and its ability to maintain solder joint integrity over time.

 

Manufactured under IATF16949 certification—the global standard for automotive quality management—the PCB undergoes rigorous testing and inspection at every stage. This includes:

 

  • Automated optical inspection (AOI) to detect surface defects, such as pinholes or solder mask bridging.
  • Elektrik Testi to verify continuity and isolation resistance, ensuring compliance with automotive electrical safety standards.
  • Termal stres testi (Örn., multiple reflow cycles at 260°C) to simulate the harsh soldering conditions encountered in automotive assembly.
  • Solderability testing to ensure the OSP finish maintains its effectiveness throughout the PCB’s shelf life (typically 6-12 months).

 

Engineers designing automotive systems will appreciate the PCB’s ability to handle the unique challenges of vehicle environments. The 3OZ copper thickness minimizes resistive heating in high-current applications, reducing the risk of thermal failure. The LPI solder mask’s matte finish and durability ensure long-term protection against corrosion and mechanical damage. The OSP finish, combined with IATF16949 compliance, provides confidence in the PCB’s reliability and traceability—a critical requirement for automotive manufacturers subject to strict quality control and recall management.

 

Whether used in engine control units, battery management systems, or advanced driver-assistance systems (ADAS), this double-sided PCB delivers the performance and compliance needed for automotive applications. Its combination of 3OZ copper, LPI Matt Green solder mask, and OSP finish, backed by IATF16949 certification, makes it a trusted choice for automotive electronics suppliers seeking to meet the industry’s highest standards for quality and reliability.

PCB özelliği


Öğe Standart PCB Özelleştirilmiş PCB
Katman sayısı 2-20 2-50
Malzeme Fr4 Merhaba Tayvan Birliği'nden Hızlı Malzeme, Ve teknoloji, Rogers vb..
PCB kalınlığı 0.4-3.2mm 0.4-6.4mm
Bakır ağırlığı Getir-3o Getir-10
Min. Delik 0.3mm 0.1Lazer Matkap tarafından MM
PCB Boyutu Min. 6.00X6.00mm maks.. 600.00X620.00mm
PCB Finish Hall, Hal-Leadfree, Kabul etmek, Enepik, Daldırma tenekesi, Dalma gümüşü, Osp
Min.SoldMask Barajı. 41 oz için Mils 2.51 oz için Mils
Hazırlık türü 2116,1080 2116,1080,7628,3313,106
Min.Width/Alan 4/4 Mils 2.5/2.5 Mils
Min. Halka halka 4/4 Mils 2.5/2.5 Mils
En boy oranı 8:1 15:1
Kurşun zamanı 2 haftalar 5 Günler - 5 Haftalar
Empedans toleransı ±5% - ±10% ±5% - ±10%
Diğer teknikler Altın parmaklar, Kör ve gömülü delikler, Soyulabilir lehim maskesi, Kenar kaplama, Karbon maskesi, Holestersink Deliği,
Yarım/Castellated Delik, Basın Deliği, Takılı/reçine ile doldurulmuş, Pad'de (vip, POFV), Bir PCB'de Çoklu Bitli

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PCBA yeteneği


HAYIR. Öğe Proses Yeteneği parametresi
1 Sipariş miktarı 1 adetten fazla
2 PCB Türü Rijit PCB, FPC, Katı fleks pcb
3 Montaj teknolojisi SMT, Tht, Karışık teknoloji veya pop
4 Bileşen kaynak Tam anahtar teslim, Kısmi anahtar teslim, Sevk edilmiş
5 PCB Boyutu 45*45mm -- 510*500mm
6 BGA paketi BGA onu. 0.14mm, BGA 0.2mm perde
7 Parça Sunumu Kaset, Makara, Sopa veya tepsiye
8 Tel & Kablo Tel kablo demeti ve kablo düzeneği
9 Kalite denetimi Görsel, SPI, Fai, AOI; X-ışını kontrolü
10 Montaj doğruluğu ±0.035mm (±0.025mm)
11 Min Paket 01005 (0.4mm*0.2mm)
12 Konformal kaplama Makine tarafından kullanılabilir
13 İc denetimi İşlev, Elektrik veya Decap Testi
14 Kurşun zamanı 3 günler - 5 Haftalar
15 Diğer teknikler Kutu Yapı Montajı, IC programlama, Bileşenler Maliyet Aşağı, İşlev & Özel olarak yaşlanma testi,
Basın montajı, SAC305 veya daha iyi lehim macunu kullanılan, BGA Reballing veya Repwork,
EMI emisyon kontrolü için kalkan örtü montajı

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FPC yeteneği


HAYIR. Öğe Proses Yeteneği parametresi
1 Katman sayısı 1-8 Katmanlar
2 FPC malzemesi Pi, Evcil hayvan, DOLMA KALEM, FR-4
3 Son kalınlık 0.06-4.0mm
4 Tahta boyutu 250.00X1200mm
5 Bakır folyo 12bir,18bir,35bir,70bir
6 Min genişlik/boşluk 3bin/3mil
7 Holewall bakır kalınlığı 8-20μm
8 Yüzey tedavisi Salon Leaddree, Kabul etmek, Daldırma gümüş/kalay, Osp
9 Boyutu özetler ± 2mils
10 Lehim ısı direnci 280℃ / 10snats
11 Sertleştirici Türü Pi, Fr4, Paslanmaz çelik, Alüminyum
12 Min. Delik Günü (Pth) 0.1mm ± 3mils
13 Min. Delik Günü (Npth) 0.25± 2mils
14 Maksimum/dk Soldmask kalınlığı 2MIL/0.5mil (50bir/12.7um)
15 Min Yuvası 0.8mm × 1mm

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