2-layer FR4 TG170 PCB is engineered for applications requiring robust current handling and reliable performance in a cost-effective design, ideal for power supplies, LED drivers, and industrial control modules. İnşa edildi FR4 TG170 material (glass transition temperature 170°C), the PCB withstands high-temperature environments, making it suitable for components that generate significant heat. . 1.2mm kalınlığı balances rigidity with weight, iken 2Oz (70μm) bakır kalınlığı on both layers supports high currents (İz başına 15a'ya kadar), minimizing voltage drop and resistive heating.
Bir 1×4 panel biçimi, the PCB optimizes production efficiency for mass manufacturing, reducing material waste and lowering costs. Each panel contains four identical boards, streamlining assembly processes for high-volume orders. . Yeşil LPI Lehim Maskesi protects circuitry from moisture and chemical damage, iken Beyaz ipek provides clear component marking for easy assembly and maintenance. . Kabul etmek (Elektroles Nikel Daldırma Altın) surface treatment ensures excellent solderability: Nikel tabakası (3–5μm) dayanıklılık ekler, Ve altın katman (0.05–0.1mm) oksidasyonu önler, maintaining reliable connections over time.
A key feature is POFV (Plated Over Filled Vias) technology, where vias are filled with conductive material and plated to create a smooth, void-free surface. This eliminates the risk of solder wicking or thermal stress failure, critical for components subjected to repeated reflow cycles. POFV also enables via-in-pad designs, allowing tighter component spacing and more efficient routing in dense layouts.
Manufacturing processes prioritize precision and quality:
- DFM analizi optimizes panelization for minimal breakage during depaneling.
- Elektrolitik bakır kaplama ensures uniform 2OZ thickness, verified by cross-sectional tests.
- Laser drilling creates vias with ±10μm accuracy before POFV filling.
- 100% AOI denetimi checks solder mask coverage and silkscreen clarity.
- Termal stres testi confirms reliability at 260°C reflow temperatures.
Engineers will appreciate the PCB’s versatility in both power and signal applications. In consumer electronics, it suits chargers and adapters requiring high-current handling. Endüstriyel ortamlarda, it excels in motor controls and power distribution blocks, where TG170 material ensures stability in warm environments. The 1×4 panel format is ideal for OEMs seeking economies of scale without compromising on performance.
By choosing this 2-layer FR4 TG170 PCB, customers gain a solution that merges 2OZ copper durability, POFV reliability, and panelized efficiency. Backed by IPC-6012 Class 2 compliance and RoHS certification, it delivers consistent quality from prototype to mass production—an optimal choice for cost-conscious projects that demand robust power handling and long-term reliability.
