This beverage dispensing machine PCBA addresses the unique requirements of food-grade automation, combining robust performance with hygiene-compliant design. . 4-katman FR4 PCB (Tg≥150°C, 1.6mm kalınlığı) ensures mechanical stability and signal integrity, while the multi-layer architecture separates power and signal domains to prevent interference in liquid control systems.

Üretim Süreci Akışı

  1. Yazdır Yapıştır:
    • Stencil printing of food-grade compatible solder paste (lead-free SAC305) ±%5 hacim doğruluğu ile 0402 components.
  2. SPI (Lehim macun muayenesi):
    • 3D optical verification of paste deposition to prevent bridging or insufficient solder in food-contact areas.
  3. Seçmek & Bileşenleri Yerleştir:
    • Yüksek hassasiyetli yerleştirme (±30μm) SMT bileşenlerinin, including microcontrollers, solenoid drivers, and moisture-resistant sensors.
  4. Yeniden Akış Lehimleme:
    • Azot destekli yeniden akış (zirve 260°C) to ensure void-free joints on ENIG surfaces, critical for corrosion resistance.
  5. AOI (Otomatik Optik İnceleme):
    • Post-reflow inspection for solder joint defects, component misalignment, and contamination risks.
  6. Tht (Delikten teknoloji):
    • Insertion of through-hole connectors and relays for high-current liquid valve control.
  7. Dalga lehimleme:
    • Kurşunsuz dalga lehimleme (250-260°C) with nitrogen, ensuring reliable connections for power-intensive components.
  8. El Lehimleme:
    • Precision manual soldering for food-grade connectors and temperature-sensitive sensors.
  9. Toplantı:
    • Integration of waterproof enclosures, anti-microbial coatings, and food-safe gaskets.
  10. OG Testi (Fonksiyonel Test):
    • Custom testing for liquid flow control, temperature regulation, and dispenser logic.
  11. KG Denetimi:
    • IPC-A-610 Sınıfına göre son denetim 2 and food industry standards (Örn., NSF/ANSI 61).

Kalite Kontrol Noktaları

  • SPI: Ensures solder paste consistency to prevent metal migration in food-contact zones.
  • AOI: taramalar 100% of joints for defects that could lead to contamination or system failure.
  • Fai (İlk Ürün Kontrolü): Comprehensive evaluation including material certification for food compatibility.
  • Röntgen Muayenesi: Verifies hidden solder joints in BGA components for long-term reliability.
  • İşlev testi: Simulates dispensing cycles, temperature fluctuations, and moisture exposure.

Tek Noktadan Hizmet Yetenekleri

  • PCB İmalatı:
    • 4-layer FR4 with 1.6mm thickness, 1OZ bakır, and ENIG finish, designed for moisture resistance.
  • Bileşenlerin Dış Kaynak Kullanımı:
    • Sourcing of food-grade certified components (Örn., IP67 connectors, NSF-listed sensors).
  • SMT&THT Entegrasyonu:
    • Mixed technology assembly supporting solenoid drivers, flow meters, and touchscreen interfaces.
  • Test & Sertifikasyon:
    • Compliance with NSF/ANSI 61 (drinking water systems), ROHS, ve ISO 9001:2015.

Beverage Dispensing Applications

  • Commercial Coffee Machines: PCBA for espresso systems, milk frothers, and temperature control.
  • Soda Vending Machines: Controls for carbonation, syrup mixing, and dispensing valves.
  • Beverage Brewing Equipment: PCBA for craft beer dispensers, cold brew systems, and tap management.
  • Water Dispensers: Filters, heaters, and UV sterilization control modules.