This beverage dispensing machine PCBA addresses the unique requirements of food-grade automation, combining robust performance with hygiene-compliant design. А 4-слой FR4 PCB (Tg≥150°C, 1.6ММ толщина) ensures mechanical stability and signal integrity, while the multi-layer architecture separates power and signal domains to prevent interference in liquid control systems.

Процесс процесса производства

  1. Печать вставки:
    • Stencil printing of food-grade compatible solder paste (lead-free SAC305) с ± 5% точности объема для 0402 components.
  2. SPI (Осмотр паяльной пасты):
    • 3D optical verification of paste deposition to prevent bridging or insufficient solder in food-contact areas.
  3. Выбирать & Поместите компоненты:
    • Высокое расположение (± 30 мкм) компонентов SMT, including microcontrollers, solenoid drivers, and moisture-resistant sensors.
  4. Стрелка пайки:
    • Азот с помощью обработки (пик 260 ° C.) to ensure void-free joints on ENIG surfaces, critical for corrosion resistance.
  5. Аои (Автоматическая оптическая проверка):
    • Post-reflow inspection for solder joint defects, component misalignment, and contamination risks.
  6. Это (Технология сквозного):
    • Insertion of through-hole connectors and relays for high-current liquid valve control.
  7. Волна пайки:
    • Без свинца волна пайки (250-260° C.) with nitrogen, ensuring reliable connections for power-intensive components.
  8. Ручная пайчка:
    • Precision manual soldering for food-grade connectors and temperature-sensitive sensors.
  9. Сборка:
    • Integration of waterproof enclosures, anti-microbial coatings, and food-safe gaskets.
  10. FG тест (Функциональный тест):
    • Custom testing for liquid flow control, temperature regulation, and dispenser logic.
  11. QA Inspection:
    • Окончательный аудит на класс IPC-A-610 2 and food industry standards (НАПРИМЕР., NSF/ANSI 61).

Точки контроля качества

  • SPI: Ensures solder paste consistency to prevent metal migration in food-contact zones.
  • Аои: Сканирование 100% of joints for defects that could lead to contamination or system failure.
  • Фей (Первая статья проверка): Comprehensive evaluation including material certification for food compatibility.
  • Рентгеновский осмотр: Verifies hidden solder joints in BGA components for long-term reliability.
  • Функциональный тест: Simulates dispensing cycles, temperature fluctuations, and moisture exposure.

Огнештные возможности обслуживания

  • Изготовление печатной платы:
    • 4-layer FR4 with 1.6mm thickness, 1Оз меди, and ENIG finish, designed for moisture resistance.
  • Компоненты Аутсорсинг:
    • Sourcing of food-grade certified components (НАПРИМЕР., IP67 connectors, NSF-listed sensors).
  • Пост&THT интеграция:
    • Mixed technology assembly supporting solenoid drivers, flow meters, and touchscreen interfaces.
  • Тестирование & Сертификация:
    • Compliance with NSF/ANSI 61 (drinking water systems), RoHS, и ISO 9001:2015.

Beverage Dispensing Applications

  • Commercial Coffee Machines: PCBA for espresso systems, milk frothers, and temperature control.
  • Soda Vending Machines: Controls for carbonation, syrup mixing, and dispensing valves.
  • Beverage Brewing Equipment: PCBA for craft beer dispensers, cold brew systems, and tap management.
  • Water Dispensers: Filters, heaters, and UV sterilization control modules.