This 6-layer FR4 PCB is designed for industrial automation, power control, and communication equipment requiring extensive component integration and reliable performance. With dimensions of 289.00×145.00mm and a 1.6mm thickness, the board provides ample space for high-power devices, relays, and multiple connectors while maintaining mechanical rigidity via FR4 material (dielectric constant εr=4.5), suitable for long-term operation in environments with temperature fluctuations and vibration.
- 6-Layer Stackup:
- 4 signal layers + 2 power/ground planes to isolate digital/analog signals and minimize EMI.
- Inner power planes optimized for 24V industrial power distribution, with ground planes stitched via vias for enhanced shielding.
- 1OZ (35μm) Copper Thickness:
- Supports up to 8-10A current (wide traces) and reduces power loop impedance via copper pours.
- Enables fine-pitch routing (min line/space: 75μm/75μm) for high-speed signals (Ethernet, CANopen).
- Blue LPI Solder Mask:
- Enhances visual contrast for component identification in complex layouts.
- Resists chemicals, oils, and coolants typical in industrial environments.
- ENIG Surface Finish:
- 3-5μm nickel layer for oxidation resistance; 0.05-0.1μm gold layer ensures long-term solderability and wire bonding compatibility.
- SMT+DIP Mixed Assembly:
- SMT: Supports 0201 passives, QFP/PGA ICs, and 0.5mm pitch BGAs.
- DIP: Accommodates through-hole connectors (DB25, terminal blocks) and relays for field wiring.
- High-Precision Fabrication:
- Laser Direct Imaging (LDI) for 75μm trace accuracy; electrolytic copper plating ensures uniform thickness.
- Edge milling for smooth, burr-free surfaces suitable for panel mounting.
- Comprehensive Testing:
- 100% AOI for solder mask and silkscreen quality.
- Flying probe testing for electrical continuity (≤0.1Ω) and isolation (≥100MΩ).
- Vibration (5-500Hz, 2G) and thermal cycling (-40°C to +85°C, 500 cycles) to simulate industrial conditions.
- Standards Compliance:
- IPC-6012 Class 2, RoHS/REACH certified.
- PLC Control Panels: Integrates programmable logic controllers, I/O modules, and power management for factory automation.
- Power Monitoring Systems: Supports current/voltage sensors, RS485 communication, and relay outputs for switchgear monitoring.
- Industrial Communication Gateways: Enables protocol conversion (Modbus RTU to Ethernet) for smart factory networks.
- Renewable Energy Inverters: Manages solar/wind power conversion with large copper pours for thermal dissipation.
