2-layer FR4 TG170 PCB is engineered for applications requiring robust current handling and reliable performance in a cost-effective design, ideal for power supplies, LED drivers, and industrial control modules. 건축 FR4 TG170 material (glass transition temperature 170°C), the PCB withstands high-temperature environments, making it suitable for components that generate significant heat. 그만큼 1.2MM 두께 balances rigidity with weight, 동안 2온스 (70μm) 구리 두께 on both layers supports high currents (추적 당 최대 15a), minimizing voltage drop and resistive heating.
a 1×4 패널 형식, the PCB optimizes production efficiency for mass manufacturing, reducing material waste and lowering costs. Each panel contains four identical boards, streamlining assembly processes for high-volume orders. 그만큼 녹색 LPI 솔더 마스크 protects circuitry from moisture and chemical damage, 동안 흰색 실크 스크린 provides clear component marking for easy assembly and maintenance. 그만큼 동의하다 (전기 전기 니켈 몰입 금) surface treatment ensures excellent solderability: 니켈 층 (3–5μm) 내구성을 추가합니다, 그리고 금 층 (0.05–0.1mm) 산화를 방지합니다, maintaining reliable connections over time.
A key feature is POFV (Plated Over Filled Vias) technology, where vias are filled with conductive material and plated to create a smooth, void-free surface. This eliminates the risk of solder wicking or thermal stress failure, critical for components subjected to repeated reflow cycles. POFV also enables via-in-pad designs, allowing tighter component spacing and more efficient routing in dense layouts.
Manufacturing processes prioritize precision and quality:
- DFM 분석 optimizes panelization for minimal breakage during depaneling.
- 전해 구리 도금 ensures uniform 2OZ thickness, verified by cross-sectional tests.
- Laser drilling creates vias with ±10μm accuracy before POFV filling.
- 100% AOI inspection checks solder mask coverage and silkscreen clarity.
- 열 응력 테스트 confirms reliability at 260°C reflow temperatures.
Engineers will appreciate the PCB’s versatility in both power and signal applications. In consumer electronics, it suits chargers and adapters requiring high-current handling. 산업 환경에서, it excels in motor controls and power distribution blocks, where TG170 material ensures stability in warm environments. The 1×4 panel format is ideal for OEMs seeking economies of scale without compromising on performance.
By choosing this 2-layer FR4 TG170 PCB, customers gain a solution that merges 2OZ copper durability, POFV reliability, and panelized efficiency. Backed by IPC-6012 Class 2 compliance and RoHS certification, it delivers consistent quality from prototype to mass production—an optimal choice for cost-conscious projects that demand robust power handling and long-term reliability.
