This 8-layer FR4 PCB addresses the challenges of high-density, narrow-format electronic designs, where space efficiency and signal integrity are critical. With dimensions of 165.50×25.90mm and a 1.6MM 두께, the board provides a compact yet robust platform for integrating complex circuitry in applications such as industrial sensors, communication modules, and portable test equipment. 건축 FR4 material, it offers stable electrical insulation (dielectric constant εr=4.5) and mechanical strength, suitable for operation in environments with moderate temperature and vibration.
- 8-Layer Stackup:
- 4 신호 레이어 + 4 power/ground planes for efficient EMI suppression
- Alternating signal and power planes minimize cross-talk and impedance variations
- 1온스 (35μm) 구리 두께:
- Balances fine-line routing (최소 선/공간: 75μm/75μm) with current-carrying capacity (up to 8A per trace)
- Precision Impedance Control:
- 50Ω ±8% for microstrip/stripline configurations
- Critical for maintaining signal integrity in high-speed interfaces (예를 들어, USB 3.0, CAN FD)
- Blue LPI Solder Mask:
- Distinctive color for easy visual inspection in narrow layouts
- Chemical resistance against industrial contaminants
- ENIG Surface Finish:
- 3–5μm nickel layer for corrosion resistance
- 0.05–0.1μm gold layer for long-term solderability and wire bonding compatibility
- Mixed SMT+DIP Assembly:
- SMT support for high-density ICs (예를 들어, microcontrollers, FPGAs)
- DIP compatibility for rugged connectors (예를 들어, 0.1” headers, terminal blocks) and through-hole components
- High-Precision Fabrication:
- Laser direct imaging (LDI) for 75μm trace accuracy
- Electrolytic copper plating with ±5% thickness uniformity
- Comprehensive Testing:
- 100% AOI inspection for solder mask and silkscreen quality
- X-ray verification of BGA vias
- Flying probe testing for electrical continuity and isolation
- Environmental Compliance:
- IPC-6012 클래스 2 for industrial applications
- RoHS/REACH compliant for hazardous substance restrictions
- Thermal cycling tested (-40°C to +85°C, 500 cycles)
- Industrial Sensor Modules:
Supports high-density sensor interfaces, signal conditioning, and communication protocols (예를 들어, Modbus, Profibus) in a narrow form factor.
- Communication Gateways:
Enables multi-protocol conversion (예를 들어, Ethernet to RS-485) with compact PCB real estate.
- Portable Test Equipment:
Integrates measurement circuitry and user interfaces in handheld devices.
- Automotive Control Units:
Fits into space-constrained compartments while maintaining signal integrity in harsh environments.
By integrating 8-layer signal isolation, 1OZ copper conductivity, and ENIG durability, this PCB delivers uncompromised performance in demanding, space-constrained applications. The blue solder mask offers visual distinction in complex layouts, while mixed SMT/DIP assembly supports both high-density digital components and robust field connections. ISO에 의해 지원됩니다 9001:2015 certification, it provides the foundation for reliable, compact electronic systems requiring both performance and durability.
