This 6-layer FR4 TG170 PCB delivers high performance for industrial automation, 5G communication modules, and other mission-critical electronics. Featuring a 1.6mm thickness, 1OZ copper on all layers, and an ENIG surface finish, it balances thermal stability, 신호 무결성, and mechanical durability effectively.

Superior Thermal & Mechanical Performance

Because it uses FR4 material with a Tg of 170°C, this PCB withstands harsh industrial environments like factory floors, outdoor communication hubs, and automotive systems. Its 6-layer design includes 4 signal layers and 2 전원/지상 비행기, which actively reduce electromagnetic interference (에미). Therefore, it ensures stable data transmission in applications such as PLCs, industrial IoT gateways, and wireless base stations.

Key Features for Reliable Connectivity

A key feature is the gold finger with 2 microinch plating, which provides excellent corrosion resistance and durable electrical contacts. This design suits systems requiring frequent board insertion/removal, including modular industrial systems and rack-mounted communication devices. Furthermore, the ENIG finish enhances solderability and wire bonding. It uses a nickel barrier to prevent oxidation and a thin gold layer optimized for fine-pitch components.

Advanced Manufacturing & 품질 보증

We apply a strict fabrication process to ensure precision and consistency:

• Inner Layer Processing: 레이저 직접 이미징 (LDI) defines fine 75μm traces on 1OZ copper.

• 교련 & 도금: Precision mechanical drilling and plated-through holes (PTH) ensure robust electrical vias.

• Outer Layer Patterning: Dry film lamination and tin plating protect circuitry during etching.

• 표면 마감: The ENIG coating combined with a green LPI solder mask enhances durability and visual clarity.

• 품질 관리: We perform 100% electrical testing (e- 테스트) and automated optical inspection (AOI) to guarantee defect-free boards. We strictly reject any X-out panels to maintain high quality.

Ideal Applications & 장점

• 산업 제어 시스템: Provide reliable power and signal integrity for PLCs and motor drives.

• 5G & Wireless Communication: Support RF integrity in 5G sub-6GHz and Wi-Fi 6 devices.

• 의료 기기: Comply with RoHS/REACH and biocompatibility standards.

• 항공 우주 & 방어: Resist vibration and temperature cycling in rugged environments.

Why Choose This 6-Layer FR4 TG170 PCB?

• Thermal Stability: It outperforms standard FR4 and reduces delamination risk.

• Reliable Gold Finger Contacts: Ensure low resistance and long-lasting performance.

• 유연한 디자인: Support mixed SMT/DIP assembly with fine-pitch compatibility.

• Global Compliance: Meet IPC-6012 Class 2 quality standards for consistent mass production.

Engineers developing smart factory automation, telecommunications infrastructure, or high-reliability medical electronics will find this PCB offers performance, scalability, and certification needed for next-generation industrial and communication technologies.