This 6-layer FR4 PCB is designed for industrial automation, power control, and communication equipment requiring extensive component integration and reliable performance. 치수와 함께 289.00×145.00mm 그리고 a 1.6MM 두께, the board provides ample space for high-power devices, relays, and multiple connectors while maintaining mechanical rigidity via FR4 material (유전 상수 εR = 4.5), suitable for long-term operation in environments with temperature fluctuations and vibration.
- 6-레이어 스택 업:
- 4 신호 레이어 + 2 power/ground planes to isolate digital/analog signals and minimize EMI.
- Inner power planes optimized for 24V industrial power distribution, with ground planes stitched via vias for enhanced shielding.
- 1온스 (35μm) 구리 두께:
- Supports up to 8-10A current (wide traces) and reduces power loop impedance via copper pours.
- Enables fine-pitch routing (min line/space: 75μm/75μm) for high-speed signals (이더넷, CANopen).
- 블루 LPI 솔더 마스크:
- Enhances visual contrast for component identification in complex layouts.
- Resists chemicals, oils, and coolants typical in industrial environments.
- ENIG 표면 마감:
- 3-5μm nickel layer for oxidation resistance; 0.05-0.1μm gold layer ensures long-term solderability and wire bonding compatibility.
- SMT+DIP Mixed Assembly:
- smt: Supports 0201 패시브, QFP/PGA ICs, and 0.5mm pitch BGAs.
- DIP: Accommodates through-hole connectors (DB25, 터미널 블록) and relays for field wiring.
- 고정밀 제조:
- Laser Direct Imaging (LDI) 75μm 추적 정확도; electrolytic copper plating ensures uniform thickness.
- Edge milling for smooth, burr-free surfaces suitable for panel mounting.
- 포괄적 인 테스트:
- 100% AOI for solder mask and silkscreen quality.
- Flying probe testing for electrical continuity (≤0.1o) 그리고 격리 (≥100mΩ).
- Vibration (5-500HZ, 2G) and thermal cycling (-40° C ~ +85 ° C, 500 사이클) to simulate industrial conditions.
- Standards Compliance:
- IPC-6012 클래스 2, RoHS/REACH certified.
- PLC Control Panels: Integrates programmable logic controllers, I/O modules, and power management for factory automation.
- Power Monitoring Systems: Supports current/voltage sensors, RS485 communication, and relay outputs for switchgear monitoring.
- Industrial Communication Gateways: Enables protocol conversion (Modbus RTU to Ethernet) for smart factory networks.
- Renewable Energy Inverters: Manages solar/wind power conversion with large copper pours for thermal dissipation.
