This beverage dispensing machine PCBA addresses the unique requirements of food-grade automation, combining robust performance with hygiene-compliant design. 그만큼 4-layer FR4 PCB (Tg≥150°C, 1.6MM 두께) ensures mechanical stability and signal integrity, while the multi-layer architecture separates power and signal domains to prevent interference in liquid control systems.
- Print Paste:
- Stencil printing of food-grade compatible solder paste (lead-free SAC305) with ±5% volume accuracy for 0402 components.
- SPI (Solder Paste Inspection):
- 3D optical verification of paste deposition to prevent bridging or insufficient solder in food-contact areas.
- Pick & Place Components:
- High-precision placement (±30μm) of SMT components, including microcontrollers, solenoid drivers, and moisture-resistant sensors.
- Reflow Soldering:
- Nitrogen-assisted reflow (peak 260°C) to ensure void-free joints on ENIG surfaces, critical for corrosion resistance.
- AOI (자동화 된 광학 검사):
- Post-reflow inspection for solder joint defects, component misalignment, and contamination risks.
- tht (통과 기술):
- Insertion of through-hole connectors and relays for high-current liquid valve control.
- Wave Soldering:
- Lead-free wave soldering (250-260°C) with nitrogen, ensuring reliable connections for power-intensive components.
- Hand Soldering:
- Precision manual soldering for food-grade connectors and temperature-sensitive sensors.
- 집회:
- Integration of waterproof enclosures, anti-microbial coatings, and food-safe gaskets.
- FG Test (Functional Test):
- Custom testing for liquid flow control, temperature regulation, and dispenser logic.
- QA Inspection:
- Final audit per IPC-A-610 Class 2 and food industry standards (예를 들어, NSF/ANSI 61).
- SPI: Ensures solder paste consistency to prevent metal migration in food-contact zones.
- AOI: Scans 100% of joints for defects that could lead to contamination or system failure.
- FAI (First Article Inspection): Comprehensive evaluation including material certification for food compatibility.
- X-ray Inspection: Verifies hidden solder joints in BGA components for long-term reliability.
- 기능 테스트: Simulates dispensing cycles, temperature fluctuations, and moisture exposure.
- PCB Fabrication:
- 4-layer FR4 with 1.6mm thickness, 1OZ copper, and ENIG finish, designed for moisture resistance.
- Components Outsourcing:
- Sourcing of food-grade certified components (예를 들어, IP67 connectors, NSF-listed sensors).
- smt&THT Integration:
- Mixed technology assembly supporting solenoid drivers, flow meters, and touchscreen interfaces.
- 테스트 & Certification:
- Compliance with NSF/ANSI 61 (drinking water systems), RoHS, and ISO 9001:2015.
- Commercial Coffee Machines: PCBA for espresso systems, milk frothers, and temperature control.
- Soda Vending Machines: Controls for carbonation, syrup mixing, and dispensing valves.
- Beverage Brewing Equipment: PCBA for craft beer dispensers, cold brew systems, and tap management.
- Water Dispensers: Filters, heaters, and UV sterilization control modules.
