This 4-layer FR4 PCB addresses the needs of industrial control and automation systems that require a balance of compact design, reliable performance, and versatile component integration. With dimensions of 107.03×42.80mm and a 1.6MM 두께, the board offers a space-efficient platform for mounting microcontrollers, communication interfaces, and power management components in devices such as sensor nodes, motor controllers, and industrial gateways. 건축 FR4 material, it provides stable electrical insulation (dielectric constant εr=4.5) and mechanical rigidity, suitable for operation in environments with moderate vibration and temperature fluctuations.
- 4-Layer Stackup:
- 2 신호 레이어 + 2 power/ground planes to minimize electromagnetic interference (에미)
- Inner layers optimized for split power domains (예를 들어, 5V/3.3V) and ground plane isolation
- 1온스 (35μm) 구리 두께:
- Supports moderate current loads (넓은 흔적 당 최대 8A) for power-hungry components
- Copper pour areas on power planes reduce voltage drop and thermal hotspots
- Blue LPI Solder Mask:
- Enhances visual contrast for component identification in dense layouts
- Chemical resistance against industrial solvents and cleaning agents
- ENIG Surface Finish:
- 3–5μm nickel layer prevents corrosion in harsh environments
- 0.05–0.1μm gold layer ensures reliable solder joints for both SMT and DIP components
- Mixed SMT+DIP Capability:
- smt: High-density placement of 0201 passive components, QFP ICs, and BGA packages (0.5mm pitch)
- DIP: Through-hole mounting for rugged connectors (예를 들어, terminal blocks, RJ45 ports) and relays
- Precision Fabrication:
- Laser direct imaging (LDI) for 75μm line/space accuracy in signal traces
- Electrolytic copper plating with uniform thickness across all layers
- Comprehensive Testing:
- 100% automated optical inspection (AOI) for solder mask coverage and silkscreen clarity
- Flying probe testing for electrical continuity (≤0.1o) 그리고 격리 (≥100mΩ)
- Thermal cycling (-40°C to +85°C, 500 cycles) to verify reliability
- Standards Compliance:
- IPC-6012 클래스 2 for industrial electronics
- ROHS/REACH는 무연 및 위험 물질 제한을 준수합니다
- Industrial IoT Sensors:
Integrates temperature/humidity sensors, wireless modules (Wi-Fi/Bluetooth), and data processing circuitry.
- Motor Control Modules:
Manages low-voltage motors in conveyor systems, with PWM control and current sensing.
- Communication Gateways:
Enables protocol conversion (예를 들어, RS-485 to Ethernet) for smart factory networks.
- Portable Test Equipment:
Supports compact measurement devices for on-site industrial diagnostics.
By combining 4-layer signal isolation, 1OZ copper conductivity, and mixed assembly flexibility, this PCB enables engineers to build robust industrial control systems in a compact form factor. The blue solder mask and ENIG finish balance visual identification with long-term reliability, while the 107.03×42.80mm layout optimizes space for both high-density components and field-wired connections. ISO에 의해 지원됩니다 9001:2015 certification, it delivers consistent performance for applications where size, 내구성, and functionality are critical.
