14-layer heavy copper PCB is designed for demanding applications that require exceptional current-carrying capacity and thermal management, 산업용 전원 공급 장치 등, renewable energy inverters, and high-power automotive systems. 다음으로 구성됨 FR4 High Tg170 material (유리전이온도 170°C), the PCB withstands prolonged exposure to high temperatures without compromising mechanical or electrical properties. 그만큼 3.5MM 보드 두께 provides rugged structural integrity, making it suitable for environments with vibration or mechanical stress, 동안 14-레이어 아키텍처 (일반적으로 8 신호 레이어 + 6 전원/지상 비행기) enables complex routing for high-density, mixed-signal designs.
The defining feature is 3온스 (105μm) copper thickness in all layers, which supports current loads up to 30A per trace—ideal for power-hungry components like IGBTs, power MOSFETs, and large inductors. This heavy copper construction minimizes resistive heating and voltage drop, critical for maintaining efficiency in high-power circuits. 그만큼 0.5mm minimum hole diameter accommodates through-hole components and vias for thermal conduction, 동안 동의하다 (전기 전기 니켈 몰입 금) surface treatment ensures reliable solderability and corrosion resistance. 니켈층 (3-5μm) provides durability, 그리고 금 층 (0.05-0.1μm) protects against oxidation, making it suitable for long-term use in harsh environments.
이 PCB를 제조하려면 정밀도와 품질을 보장하는 고급 기술이 필요합니다.:
- DFM (제조 가능성을위한 설계) 분석 optimizes layer stacking and via placement to prevent thermal stress and maximize copper utilization.
- 레이저 드릴링 achieves 0.5mm holes with ±10μm accuracy, essential for maintaining via integrity in thick boards.
- 전해 구리 도금 ensures uniform 3OZ thickness across all layers, 단면 분석에 의해 확인.
- Impedance control (optional for signal layers) maintains consistent performance for high-speed interfaces.
- 100% AOI (자동화 된 광학 검사) and X-ray verification of internal layers ensure defect-free production.
Engineers will appreciate the PCB’s ability to handle both high-power and high-reliability requirements. In industrial applications, it excels in motor drives and control panels, where heat dissipation and current stability are critical. In renewable energy systems, the heavy copper layers support efficient power conversion in inverters and battery management systems. The High Tg170 material ensures the PCB remains stable in under-hood automotive environments or industrial machinery exposed to continuous operation at elevated temperatures.
By choosing this 14-layer heavy copper PCB, customers gain a solution that balances extreme power capability with design flexibility. Its combination of 3OZ copper in all layers, 3.5MM 두께, and ENIG finish makes it a strategic choice for applications where power density, 열 관리, 장기적인 신뢰성은 협상할 수 없습니다.. IPC-6012 클래스의 지원 2/3 규정 준수 (optional) and rigorous thermal cycling tests, this PCB ensures consistent performance from prototype to mass production in the most demanding high-power electronic systems.
