10-layer impedance controlled FR4 PCB is engineered for high-speed electronic systems requiring precise signal integrity, such as data centers, network equipment, and advanced communication devices. The multi-layer structure combines 10 layers of FR4 substrate (1.6mm total thickness) to enable complex routing for high-density circuits, 동안 BGA (Ball Grid Array) with plugged vias ensures reliable interconnects for critical components. 그만큼 50Ω±8% impedance control minimizes signal reflection and crosstalk, making it ideal for high-frequency applications like PCIe 4.0, USB 3.2, or Ethernet systems.
그만큼 동의하다 (전기 전기 니켈 몰입 금) surface treatment provides a smooth, oxidation-resistant finish, enhancing solderability and long-term reliability. FR4 material offers a balance of cost-effectiveness and electrical stability (dielectric constant εr=4.5), suitable for both commercial and industrial use. Our advanced manufacturing process includes:
- Laser Direct Imaging (LDI) for fine-line precision (minimum line width/space: 50μm/50μm)
- Automated Impedance Testing at each layer to ensure ±8% tolerance compliance
- 100% AOI (자동화 된 광학 검사) and flying probe tests for defect detection
As an ISO 9001:2015 certified manufacturer, we offer DFM (Design for Manufacturability) analysis to optimize your design for production, reducing costs and lead times. This PCB is ideal for engineers seeking high-performance, reliable solutions for next-gen electronics.
