2-layer FR4 TG170 PCB is engineered for applications requiring robust current handling and reliable performance in a cost-effective design, ideal for power supplies, LED drivers, and industrial control modules. Construit à partir de FR4 TG170 material (glass transition temperature 170°C), the PCB withstands high-temperature environments, making it suitable for components that generate significant heat. Le 1.2mm d'épaisseur balances rigidity with weight, Pendant que le 2Oz (70μm) épaisseur de cuivre on both layers supports high currents (Jusqu'à 15A par trace), minimizing voltage drop and resistive heating.
Conçu dans un 1×4 format de panneau, the PCB optimizes production efficiency for mass manufacturing, reducing material waste and lowering costs. Each panel contains four identical boards, streamlining assembly processes for high-volume orders. Le Masque de soudure LPI verte protects circuitry from moisture and chemical damage, Pendant que le Écran à soigneux blanc provides clear component marking for easy assembly and maintenance. Le Accepter (Or d'immersion nickel électrolaire) surface treatment ensures excellent solderability: la couche nickel (3–5 μm) ajoute de la durabilité, Et la couche d'or (0.05–0,1 mm) Empêche l'oxydation, maintaining reliable connections over time.
A key feature is POFV (Plated Over Filled Vias) technology, where vias are filled with conductive material and plated to create a smooth, void-free surface. This eliminates the risk of solder wicking or thermal stress failure, critical for components subjected to repeated reflow cycles. POFV also enables via-in-pad designs, allowing tighter component spacing and more efficient routing in dense layouts.
Manufacturing processes prioritize precision and quality:
- Analyse DFM optimizes panelization for minimal breakage during depaneling.
- Placage électrolytique en cuivre ensures uniform 2OZ thickness, verified by cross-sectional tests.
- Laser drilling creates vias with ±10μm accuracy before POFV filling.
- 100% AOI inspection checks solder mask coverage and silkscreen clarity.
- Tests de contrainte thermique confirms reliability at 260°C reflow temperatures.
Engineers will appreciate the PCB’s versatility in both power and signal applications. In consumer electronics, it suits chargers and adapters requiring high-current handling. En milieu industriel, it excels in motor controls and power distribution blocks, where TG170 material ensures stability in warm environments. The 1×4 panel format is ideal for OEMs seeking economies of scale without compromising on performance.
By choosing this 2-layer FR4 TG170 PCB, customers gain a solution that merges 2OZ copper durability, POFV reliability, and panelized efficiency. Backed by IPC-6012 Class 2 compliance and RoHS certification, it delivers consistent quality from prototype to mass production—an optimal choice for cost-conscious projects that demand robust power handling and long-term reliability.
