This 6 – layer FR4 TG170 PCB is a meticulously engineered solution tailored for the demanding automotive industry, backed by the prestigious IATF16949 certification. In the automotive field, reliability and performance are nonnegotiable, and this PCB rises to the challenge with its advanced features and highquality construction.

1. Material and Structural Advantages

  • FR4 TG170 Material: Constructed from FR4 material with a glass transition temperature (Tg) of 170°C, it offers superior thermal stability. In automotive applications, where components are often exposed to elevated temperatures, especially in the engine compartment or during longdistance driving, this highTg material ensures that the PCB remains dimensionally stable. It reduces the risk of warping, delamination, and electrical performance degradation, which are critical issues in automotive electronics. For example, in automotive ADAS (Advanced DriverAssistance Systems) where sensors and processing units generate heat, the TG170 material can effectively withstand the heat without compromising the integrity of the board.
  • 1.6mm Board Thickness: With a 1.6mm thickness, the PCB strikes a balance between mechanical strength and weight. In automotive design, where space and weight are carefully optimized, this thickness provides enough rigidity to withstand vibrations and mechanical shocks during vehicle operation. En même temps, it is not overly heavy, which is crucial for maintaining fuel efficiency and overall vehicle performance.
  • 1OZ Copper on All Layers: All layers are fabricated with 1OZ (35μm) copper, which provides excellent electrical conductivity. This thickness is suitable for handling the electrical currents required in automotive circuits, whether it’s powering sensors, actuators, or communication modules. The 1OZ copper also enables fineline routing (with a minimum line/space of 75μm/75μm), allowing for highdensity component placement, a common requirement in modern automotive electronics where more functionality is being packed into smaller spaces.

2. Surface Finish and Solder Mask

  • ENIG Surface Finish: The Electroless Nickel Immersion Gold (Accepter) surface finish is a key feature of this PCB. Le 3 – 5μm nickel barrier layer effectively prevents copper oxidation, Pendant que le 0.05 – 0.1μm gold layer on top ensures excellent solderability and wirebonding compatibility. In the automotive environment, where connectors are frequently mated and unmated, and components need to maintain reliable electrical connections over long periods, the ENIG finish provides the necessary durability and corrosion resistance.
  • Black Solder Mask: The black solder mask not only enhances the aesthetic appearance of the PCB but also offers practical benefits. It provides better visual contrast for component identification, which is useful during assembly and maintenance. Additionally, the black solder mask has superior UV resistance, which is important for automotive applications where the PCB may be exposed to sunlight, especially in vehicles with transparent covers or in outdooruse automotive electronics.

3. Special Features for Automotive Applications

  • BGA Support: Ball Grid Array (BGA) components are increasingly used in automotive electronics for their highdensity packaging and excellent electrical performance. This PCB is designed to support BGA components, with optimized layout and vias to ensure reliable connections. The PCB’s manufacturing process is carefully controlled to meet the tight tolerances required for BGA soldering, reducing the risk of solder joint failures, which can be catastrophic in automotive systems.
  • Outline Routing: The PCB undergoes precise outline routing, achieving tight mechanical tolerances (±0.1mm). This is essential for automotive applications as it ensures a perfect fit within the vehicle’s enclosures. The smooth, burrfree edges produced by outline routing also contribute to the overall durability of the PCB, protecting it from damage during installation and operation in the rugged automotive environment.

4. Manufacturing Process and Quality Assurance

  • Rigorous Manufacturing Process: The PCB is fabricated through a comprehensive process. Starting with innerlayer processing, laser direct imaging (LDI) is used to define 75μm traces on 1OZ copper cores, followed by etching to form the inner circuitry. Highprecision mechanical drilling creates vias with ±50μm accuracy, which are then coated with electroless and electrolytic copper to achieve a uniform 35μm thickness for robust throughhole connections. After dryfilm lamination and UV exposure to define the outerlayer traces, tin plating protects conductive areas during etching. Finally, the ENIG surface finish is applied after soldermask curing.
  • IATF16949Compliant Quality Control: Being IATF16949 certified means that the entire manufacturing process, from raw material sourcing to final product inspection, adheres to the strict quality management system requirements of the automotive industry. Every board undergoes 100% electrical testing (Etest) to verify continuity (≤0.1Ω) and isolation (≥100MΩ). Xray inspection checks via integrity, and automated optical inspection (AOI) ensures soldermask coverage, trace quality, and overall board quality. Xout panels are strictly rejected, ensuring that only defectfree PCBs are delivered to automotive customers.

5. Applications in the Automotive Field

  • Advanced DriverAssistance Systems (ADAS): In ADAS, which includes functions such as collision avoidance, lanekeeping assist, and adaptive cruise control, this PCB can be used to integrate sensors (like cameras, radar, and lidar), processing units, and communication modules. The highspeed signal routing capabilities of the 6 – layer design, along with its thermal stability, are crucial for the realtime data processing and reliable operation required in ADAS.
  • Infotainment Systems: For invehicle infotainment systems that provide navigation, audio, and video services, the PCB’s ability to support highdensity component placement and its reliable electrical performance are essential. The BGA support allows for the integration of powerful processors and memory modules, while the ENIG finish ensures longlasting connectivity for various input and output interfaces.
  • Powertrain Control: In powertrain control systems that manage the engine, transmission, and other powerrelated components, the PCB’s robustness against vibrations, thermal stability, and highcurrenthandling capabilities (thanks to 1OZ copper) make it an ideal choice. The IATF16949 certification also gives automotive manufacturers confidence in the quality and reliability of the PCB in this critical application area.

 

In summary, this 6 – layer FR4 TG170 PCB, with its suite of advanced features, highquality manufacturing process, and IATF16949 certification, is a toptier solution for automotive applications, providing the reliability, performance, and quality demanded by the automotive industry.

Capacité de PCB


Article PCB standard PCB personnalisé
Nombre de couches 2-20 2-50
Matériel FR4 Hi Speed ​​Material de Taiwan Union, Et la technologie, Matériau haute fréquence de Rogers, etc..
Épaisseur de PCB 0.4-3.2MM 0.4-6.4MM
Poids en cuivre Apporter-3o Apporter-10
Min. Diamètre du trou 0.3MM 0.1mm par perceuse laser
Taille du PCB Min. 6.00X6,00 mm max. 600.00X620,00 mm
Finition PCB Hal, Sans coup de coude, Accepter, Énipique, Étain à immersion, Immersion Silver, OSP
Min.Soldermask Dam. 4mils pour 1 oz 2.5mils pour 1 oz
Type préimprégné 2116,1080 2116,1080,7628,3313,106
Min.Width / Space 4/4 mils 2.5/2.5 mils
Min. Bague annulaire 4/4 mils 2.5/2.5 mils
Rapport d'aspect 8:1 15:1
Délai de mise en œuvre 2 semaines 5 Jours - 5 Semaines
Tolérance à l'impédance ±5% - ±10% ±5% - ±10%
Autres techniques Doigts d'or, Trous aveugles et enterrés, Masque de soudure pelable, Placage de bord, Masque de carbone, Trou de contre-coup,
Moins / trou castel, Press Fit Hole, Via bouché / rempli de résine, Via le pad (VIP, POFV), Multi-finisses sur un PCB

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Capacité PCBA


Non. Article Paramètre de capacité de processus
1 Quantité de commande Plus de 1 pc
2 Type de PCB PCB rigide, FPC, PCB flex rigide
3 Tech-Assembly Smt, Tht, Tech mixte ou pop
4 Approvisionnement des composants Tournable complet, Clé en main partielle, Consigné
5 Taille du PCB 45*45MM -- 510*500MM
6 Package BGA Bga elle. 0.14MM, Bga 0,2 mm
7 Présentation des pièces Ruban adhésif, Bobine, Bâton ou plateau
8 Fil & Câble Harnais de fil et ensemble de câbles
9 Inspection de qualité Visuel, Spice, Fai, AOI; Vérification des rayons X
10 Précision de montage ±0.035MM (±0.025MM)
11 Paquet 01005 (0.4mm * 0,2 mm)
12 Revêtement conforme Disponible par machine
13 Inspection IC Fonction, Test électrique ou décap
14 Délai de mise en œuvre 3 jours - 5 Semaines
15 Autres techniques Assemblage de construction de boîtes, Programmation IC, Composants coûts, Fonction & Test de vieillissement comme coutume,
Assemblage de la pointe, SAC305 ou meilleure pâte de soudure utilisée, BGA Reballing ou Rework,
Assemblage de couvercle de bouclier pour le contrôle des émissions EMI

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Capacité FPC


Non. Article Paramètre de capacité de processus
1 Nombre de couches 1-8 Couches
2 Matériau FPC PI, ANIMAL DE COMPAGNIE, STYLO, FR-4
3 Épaisseur finale 0.06-4.0MM
4 Taille du conseil d'administration 250.00X1200 mm
5 Feuille de cuivre 12un,18un,35un,70un
6 Largeur / espace min 3mille / 3mil
7 Épaisseur de cuivre 8-20μm
8 Traitement de surface Hall Leaddree, Accepter, Immersion Silver / Tin, OSP
9 Décrit la dimension ± 2mils
10 Résistance à la chaleur 280℃ / 10secondes
11 Type de raidisseur PI, FR4, Acier inoxydable, Aluminium
12 Min. Jour de trou (Pth) 0.1mm ± 3mils
13 Min. Jour de trou (Npth) 0.25± 2mils
14 Épaisseur de max / min à souder 2Mil / 0,5 mil (50un / 12h7)
15 Mine 0.8mm × 1 mm

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