This 4-layer FR4 PCB addresses the needs of industrial control and automation systems that require a balance of compact design, reliable performance, and versatile component integration. With dimensions of 107.03×42.80mm and a 1.6mm d'épaisseur, the board offers a space-efficient platform for mounting microcontrollers, communication interfaces, and power management components in devices such as sensor nodes, motor controllers, and industrial gateways. Construit à partir de FR4 material, it provides stable electrical insulation (dielectric constant εr=4.5) and mechanical rigidity, suitable for operation in environments with moderate vibration and temperature fluctuations.
- 4-Layer Stackup:
- 2 Couches de signalisation + 2 power/ground planes to minimize electromagnetic interference (EMI)
- Inner layers optimized for split power domains (Par exemple, 5V/3.3V) and ground plane isolation
- 1Oz (35μm) Copper Thickness:
- Supports moderate current loads (up to 8A per wide trace) for power-hungry components
- Copper pour areas on power planes reduce voltage drop and thermal hotspots
- Blue LPI Solder Mask:
- Enhances visual contrast for component identification in dense layouts
- Chemical resistance against industrial solvents and cleaning agents
- ENIG Surface Finish:
- 3–5μm nickel layer prevents corrosion in harsh environments
- 0.05–0.1μm gold layer ensures reliable solder joints for both SMT and DIP components
- Mixed SMT+DIP Capability:
- Smt: High-density placement of 0201 passive components, QFP ICs, and BGA packages (0.5mm pitch)
- DIP: Through-hole mounting for rugged connectors (Par exemple, terminal blocks, RJ45 ports) and relays
- Precision Fabrication:
- Laser direct imaging (LDI) for 75μm line/space accuracy in signal traces
- Electrolytic copper plating with uniform thickness across all layers
- Comprehensive Testing:
- 100% automated optical inspection (AOI) for solder mask coverage and silkscreen clarity
- Flying probe testing for electrical continuity (≤0.1Ω) and isolation (≥100MΩ)
- Thermal cycling (-40°C to +85°C, 500 cycles) to verify reliability
- Standards Compliance:
- IPC-6012 Class 2 for industrial electronics
- RoHS/REACH compliant for lead-free and hazardous substance restrictions
- Industrial IoT Sensors:
Integrates temperature/humidity sensors, wireless modules (Wi-Fi/Bluetooth), and data processing circuitry.
- Motor Control Modules:
Manages low-voltage motors in conveyor systems, with PWM control and current sensing.
- Communication Gateways:
Enables protocol conversion (Par exemple, RS-485 to Ethernet) for smart factory networks.
- Portable Test Equipment:
Supports compact measurement devices for on-site industrial diagnostics.
By combining 4-layer signal isolation, 1OZ copper conductivity, and mixed assembly flexibility, this PCB enables engineers to build robust industrial control systems in a compact form factor. The blue solder mask and ENIG finish balance visual identification with long-term reliability, while the 107.03×42.80mm layout optimizes space for both high-density components and field-wired connections. Soutenu par ISO 9001:2015 certification, it delivers consistent performance for applications where size, durability, and functionality are critical.
